Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis

Huang, Chien‐Yi; Huang, Hui-Hua; Ying, Kuo‐Ching

doi:10.1109/tcpmt.2011.2177093

Cited by 11 publications

(7 citation statements)

References 23 publications

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“…Dilute Ni additions reduce the solubility of Cu in liquid tin [3,4], such that Sn-0.7Cu is a hypoeutectic composition (in the βSn primary phase field) and Sn-0.7Cu-0.05Ni is in the Cu6Sn5 primary phase field [5]. 0.05wt%Ni has been found to strongly increase the ability of Sn-Cu-Ni alloys to flow as they solidify [5][6][7] which improves drainage and reduces bridging and icicles in wave soldering [5,8]. Furthermore, the dilute Ni addition has been demonstrated to significantly affect the intermetallics that form during soldering.…”

Section: Introductionmentioning

confidence: 99%

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Belyakov

Xian

Sweatman

et al. 2017

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Belyakov

Xian

Sweatman

et al. 2017

Journal of Alloys and Compounds

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“…With rising environmental awareness in recent years, green packaging has become popular, along with lead-free processing. Thus, parameter setting and materials selection are more complicated than in the past (Bath et al , 2007; Huang et al , 2012). Failure to comply with quality control standards for circuit board assembly must be addressed by additional inspection and work, which can increase the total production cost by roughly 50 per cent (Tsai and Tsai, 2014; Soto, 1998).…”

Section: Introductionmentioning

confidence: 99%

Applying data mining methodology to establish an intelligent decision system for PCBA process

Huang

Ruano

Chen

et al. 2019

SSMT

Self Cite

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Purpose This paper aims to consider the practical production environment of electronics manufacturing industry firms, and the large quantities of information collected on machine processes, testing data and production reports, while simultaneously taking into account the properties of the processing environment, in conducting analysis to obtain valuable information. Design/methodology/approach This research constructs a prediction model of the circuit board assembly process yield. A decision tree is used to extract the key attributes. The authors also integrate association rules to determine the relevance of key attributes of undesirable phenomena. Findings The results assure the successful application of the methodology by reconfirming the rules for solder skip and short circuit occurrence and their causes. Originality/value Measures for improvement are recommended, production parameters determined and debugging suggestions made to improve the process yield when the new process is implemented.

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“…Many studies have been conducted on wave soldering and its various aspects, including its material and mechanical characteristics (Kuo et al 2013), PTH defects (Suganuma et al 2000), low silver alloy (Wang et al 2013), the intelligence system of the process control (Pietraszek et al 2014;Liukkonen et al 2009), and process optimization (Liukkonen et al 2011;Huang et al 2012). Most of these studies were conducted through experiments.…”

Section: Introductionmentioning

confidence: 99%

“…Thus, an intelligence system (Pietraszek et al 2014;Liukkonen et al 2009) has been developed and employed to identify defects and determine their dominant process parameters during wave soldering. Process optimization (Liukkonen et al 2011;Huang et al 2012; Wang et al 2011) (i.e., self-organizing maps and multivariate analysis) has also been employed to control the quality and reliability of PTH solder joints during wave soldering.…”

Section: Introductionmentioning

confidence: 99%

Effects of PCB thickness on adjustable fountain wave soldering

Aziz

Abdullah

Khor

et al. 2015

Sadhana

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This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0 • and 6 •. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

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Sn–Cu–Ni Soldering Process Optimization Using Multivariate Analysis

Cited by 11 publications

References 23 publications

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Influence of bismuth on the solidification of Sn-0.7Cu-0.05Ni-xBi/Cu joints

Applying data mining methodology to establish an intelligent decision system for PCBA process

Effects of PCB thickness on adjustable fountain wave soldering

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