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Purpose -The purpose of this paper is to investigate how to reduce the time and cost required to conduct reliability testing. With increasing competition in the electronics industry and reduction in product life cycles, it is essential to diminish the time required for new product development and thus time to market. Design/methodology/approach -This study conducts empirical sample test for wireless card and analyzes the fatigue life through finite element modeling (FEM). Simulation results are compared to the data collected from a temperature cycling test under conditions of 2408C to 1508C and 2408C to 1008C. Findings -Assuming that the results of product lifetime from empirical sample test and software simulation exhibit a linear relationship, a "scale factor" should exist for any given product structure, process condition and materials composition scenario. The scale factors were found to be approximately 0.1 in both temperature cycling scenarios. Also, the effectiveness of various adhesive dispensing patterns on solder joint reliability is evaluated through software simulation. The L shape adhesive dispensing was proven to effectively enhance the fatigue life of chip scale package solder joints roughly 100-fold. Originality/value -The scale factor is used to convert the results from software simulation to empirical sample test for a given set of processing environments and materials. This helps to reduce the time and cost required to conduct reliability testing.

This study aimed to explore Printed Circuit Board (PCB) failure mechanism and recommend appropriate material and handling process for the boards used in lead-free assembly process. In this study, the most stringent conditions in Printed Circuit Board Assembly (PCBA) process was used for various base-materials of PCB, such as Tg, and curing agent. In addition, thermal shock testing at 0∼100°C for 900 cycles was employed to simulate PCB performance during field service. Cross-section analysis was implemented to identify failure modes. Finally, the PCB moisture absorption property was evaluated by exposing the boards in a temperature/humidity chamber at 28°C and 60% RH, that was the worst condition in PCBA production environment. Results indicated that Tg had significant influence to the PCB quality, high Tg materials performs better. During multiple reflow process verification, cross section analysis of high Tg material indicated that Dicy material appear delamination even no electrical failure occurred. As for thermal shock test, high Tg material (either with Dicy or Phenolic curing agent) survived after 900 shock cycles. Also, moisture uptake in assembly environment, even at the worst scenario of 28°C and 60% RH for 120 hours, had not caused any PCB delamination.