2010
DOI: 10.1016/j.cplett.2009.11.030
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Sn etching with hydrogen radicals to clean EUV optics

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Cited by 46 publications
(38 citation statements)
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“…A group of low melting point metals, including tin (Sn) [22][23][24][25], indium (In) [23,26,27], gallium (Ga) [28] and bismuth (Bi) [29], have been adopted to mediate the VLS growth of SiNWs in a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. In this way, we have demonstrated Sn assisted SiNW growth at a substrate temperature as low as 240 1C [23], with yet a very important bonus that after growing the SiNWs into a desired length, the remnant Sn can be removed by a simple hydrogen (H 2 ) plasma etching without the need of any ex situ cleaning [30]. All these unique abilities enabled us to fabricate a-Si:H radial PIN junction solar cells showing conversion efficiencies up to 6% [31,32].…”
Section: Introductionmentioning
confidence: 97%
“…A group of low melting point metals, including tin (Sn) [22][23][24][25], indium (In) [23,26,27], gallium (Ga) [28] and bismuth (Bi) [29], have been adopted to mediate the VLS growth of SiNWs in a Plasma Enhanced Chemical Vapor Deposition (PECVD) system. In this way, we have demonstrated Sn assisted SiNW growth at a substrate temperature as low as 240 1C [23], with yet a very important bonus that after growing the SiNWs into a desired length, the remnant Sn can be removed by a simple hydrogen (H 2 ) plasma etching without the need of any ex situ cleaning [30]. All these unique abilities enabled us to fabricate a-Si:H radial PIN junction solar cells showing conversion efficiencies up to 6% [31,32].…”
Section: Introductionmentioning
confidence: 97%
“…The transformation can then lead to a sizable reduction of tin deposition. This is often rather difficult to achieve in reasonably short time by other methods of dry cleaning like, for example, plasma etching schemes with hydrogen radicals [19,20].…”
Section: Introductionmentioning
confidence: 99%
“…Once SnO 2 was removed from the glass surface, the bonding strength between Sn particles and glass surface loosened, resulting in a removal of Sn particles from glass surface. Therefore, Sn can be etched by floating wire-assisted H 2 /Ar plasma, this can be applied to remove the Sn contamination on EUV optics of EUV lithography systems [11][12][13][14] .…”
Section: Model Of Forming Spherical Sn Particles By H 2 /Ar Plasma Tmentioning
confidence: 99%
“…Tin (Sn) metal has been extracted from ores for a long time 1 , 2 , and is a highly demanded material for different industrial applications including Pb-free solder 3 , 4 , 5 , batteries 6 8 , and transparent electrodes 9 , 10 . Removal of Sn contamination on extreme ultraviolet (EUV) lithography optics can be applied by using H radicals 11 – 14 . Moreover, Sn nano/micro-particles embedded in SiO 2 matrix or Sn-implanted SiO 2 structure are potentially applied in development of novel devices 15 , 16 .…”
Section: Introductionmentioning
confidence: 99%