Software restructuring

Arnold, Robert S.

doi:10.1109/5.24146

Cited by 49 publications

(37 citation statements)

References 5 publications

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“…Thus, the vast majority of defects found in code reviews seem to have been ignored in most published studies. While one may question the value of discovering evolvability defects, several studies from academia and industry [2], [4], [5], [13], [17], [23], [27], [30], [46], [51], [57], [62], [69] indicate that poor evolvability results in increased development effort in terms of lower productivity and greater rework.…”

mentioning

confidence: 99%

What Types of Defects Are Really Discovered in Code Reviews?

Mäntylä¹,

Lassenius²

2009

IIEEE Trans. Software Eng.

161

108

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mentioning

confidence: 99%

What Types of Defects Are Really Discovered in Code Reviews?

Mäntylä¹,

Lassenius²

2009

IIEEE Trans. Software Eng.

161

108

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“…[1][2][3][4][5] Whisker growth results in many serious short-term and long-term reliability issues in the electronic assemblies used in critical applications, for example aviation and space, defense, medical devices, etc., in which whisker-induced electrical short circuits and mass redistribution in conductors have resulted in complete failure of commercial satellites, defense systems, and medical equipments. 6,7 Alloying with Pb has been reported to reduce the extent of whisker formation on Sn coatings [7][8][9][10] ; this effect has been attributed to substantial reduction of the maximum compressive stress generated in Sn coatings on addition of Pb. 9,10 However, the worldwide acceptance of the European Union's Restriction of Hazardous Substances (RoHS) Act-2006 prescribing complete elimination of Pb from all electronic components 11 has resulted in re-emergence of reliability issues associated with tin whiskering.…”

Section: Introductionmentioning

confidence: 99%

Manipulating Crystallographic Texture of Sn Coatings by Optimization of Electrodeposition Process Conditions to Suppress Growth of Whiskers

Jagtap

Kumar

2015

Journal of Elec Materi

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The effects of two major electrodeposition process conditions, electrolyte bath temperature and current density, on the microstructure and crystallographic texture of pure tin coatings on brass and, ultimately, on the extent of whisker formation have been examined. The grain size of the deposited coatings increased with increasing electrolyte bath temperature and current density, which significantly affected the dominant texture: (211) or (420) was the dominant texture at low current densities whereas, depending on deposition temperature, (200) or (220) became the dominant texture at high current densities. After deposition, coatings were subjected to different environmental conditions, for example isothermal aging (room temperature, 50°C, or 150°C) for up to 90 days and thermal cycling between À25°C and 85°C for 100 cycles, and whisker growth was studied. The Sn coatings with low Miller index planes, for example (200) and (220), and with moderate aging temperature were more prone to whiskering than coating with high Miller index planes, for example (420), and high aging temperature. A processing route involving the optimum combination of current density and deposition temperature is proposed for suppressing whisker growth.

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“…The reengineering process is usually composed of three activities: reverse engineering [52], software restructuring [9] and forward engineering.…”

Section: Reverse Engineering and Reengineeringmentioning

confidence: 99%