Solder joint reliability in automotive applications: Analysis methods and assessment criteria

Steller, Antje; Pape, Uwe; Lange, Petrik

doi:10.1109/isse.2009.5206937

Cited by 5 publications

(3 citation statements)

References 8 publications

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“…The development of the electronic devices, including the increase of their reliability, plays an important role in the aerospace and automotive industries. 1,2 The vibration loadings as well as thermal cycling are the most significant external factors influencing the useful lifetime and the stability of power electronic systems in these industries. Hence, there is a lot of interest to study the fatigue life of electronic power devices.…”

Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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In this work, the combination of vibration loading and thermal cycle effects on the fatigue properties of a solder joint in a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) discrete was investigated. The fatigue mechanism under each loading mode was individually analyzed, and then according to the incremental damage superposition approach, the simultaneous effects were thoroughly studied. Under thermal cycling, the creep behavior of the solder is linked to the fatigue life. In fact, the creep accumulated strain in each thermal cycle has a straight relation to the failure time of solder joint. The origin of stress/strain in the assembly is owing to the sharp difference between coefficients of thermal expansions of the components in the electronic package. Regarding the vibration loading, the root mean square of peeling stress as a widely acceptable failure indicator was used to evaluate the vibration effects on the fatigue life. It is determined that the maximum stress is concentrated at the corner of solder layer. This result was similar to the outcomes of thermal cycling. The results also indicated that the combination of thermal and mechanical loadings accelerates the failure of the solder joint of the power MOSFET. Furthermore, the experimental and simulation studies showed similar results and approved the crack initiation at the corner of solder layer.

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Section: Introductionmentioning

confidence: 99%

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Ghaderi

Pourmahdavi

Samavatian

et al. 2018

Proceedings of the Institution of Mechanical Engineers, Part L:

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show abstract

“…Data resources expressed in Pecht (2008), Xu et al (2018) validate that 20% of failure occurrence in the solder joints of electronic devices are originated from mechanical shocks including random vibration and dropping effects. It was extensively reported that the solder joints in electronic devices have appropriated substantial share in mechanical failure of the systems (Fang et al , 2016; JEDEC, 2003; Steller et al , 2009).…”

Section: Introductionmentioning

confidence: 99%

An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

Wang

Zhang

Huang

et al. 2020

SSMT

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Purpose The purpose of this paper is to propose a method with capability of short-time implementation. Design/methodology/approach This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints. Findings A new method with good agreement with experimental tests has been proposed. Originality/value It is confirmed that paper is original.

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“…Solder joints are typically the weak ties inside electronic systems in terms of durability that act as mechanical and electrical contacts and the solder joints may withstand a number of loads (Su et al , 2020; Muhammad et al ,2020; Tang et al , 2019; Wan et al , 2018; Ali et al , 2018). Thermal heating, vibrational frequencies, electrical current effects and harsh environmental conditions are factors that affect the solder joints reliability (Steller et al , 2009; Samavatian et al ,2019; Ugur et al , 2019). The electrical reliability is one of the most critical parameters of solder joints.…”

Section: Introductionmentioning

confidence: 99%

An investigation on function of current type on solder joint degradation in electronic packages

Cai

Huang

Li³

et al. 2020

SSMT

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Purpose As in real applications several alternating current (AC) currents may be injected to the electronic devices, this study aims to analyze their effects on the lifetime of the solder joints and, consequently, shed the light on these effects at the design phase for other researchers to consider. Design/methodology/approach In this paper, the authors investigated on current waveform shapes on the performance and reliability of the solder joints in electronic package. Three common and extensively used current shapes in several simulations and experiments were selected to study their effects on the solder joint performance. Findings The results demonstrate a sever thermal swing and stress fluctuation in the solder joint induced in the case of triangle current type because the critical states lack any relaxation time. In fact, the stress intensification in the solder under application of the triangle current type has been shown to contribute to increasing brittle intermetallic compounds. An accelerated increase of on-state voltage of power semiconductor was also observed in under application of the triangle current type. Originality/value The originality of this paper is confirmed.

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Solder joint reliability in automotive applications: Analysis methods and assessment criteria

Cited by 5 publications

References 8 publications

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

Combination of thermal cycling and vibration loading effects on the fatigue life of solder joints in a power module

An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

An investigation on function of current type on solder joint degradation in electronic packages

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