Solder-joint reliability of HVQFN-packages subjected to thermal cycling

Vries, J. de; Jansen, M.; Driel, W.D. van

doi:10.1016/j.microrel.2008.12.007

Cited by 15 publications

(1 citation statement)

References 12 publications

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“…As a result, high stress and nonlinear strain accumulation in solder joints can be induced due to the significant mismatch in the coefficients of thermal expansion (CTE) of dissimilar materials, which leading to the short thermal fatigue life of QFN package. The evaluation for thermal fatigue reliability of QFN package is an important work at new product research and development (R&D) phase [1][2].…”

Section: Introductionmentioning

confidence: 99%

Finite element based DOE methodology for thermal fatigue reliability design of multi-row QFN packages

Xia

Qin

Gao

et al. 2013

2013 14th International Conference on Electronic Packaging Technology

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A DOE (Design of Experiment) methodology based on finite element analysis is presented to investigate thermal fatigue reliability of multi-row QFN packages. In this method, the influences of material properties, structural geometries and temperature cycling profiles on thermal fatigue reliability are evaluated, a L27(3 8 ) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element model. The modified Coffin-Manson model is employed to predict the fatigue life of solder joints. Results indicate that CTE of PCB board, the height of solder joint and CTE of epoxy molding compound have critical influence on thermal fatigue life of solder joints. The fatigue life of multi-row QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after optimized factor combination design.

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Section: Introductionmentioning

confidence: 99%