Solder joints reliability of through hole assemblies with various land and hole design

Sobolewski, Maciej; Wojewoda-Budka, J.; Huber, Z.; Zięba, P.; Wierzbicka-Miernik, A.

doi:10.1016/j.microrel.2021.114368

Cited by 6 publications

(1 citation statement)

References 23 publications

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“…The RoHS Directive enforced in the EU regulates the use of lead-containing solder for joining in the field of electronic devices, and Sn-Ag and Sn-Cu eutectic solders are used as lead-free solders [1][2][3][4][5]. However, these solders have a melting point of around 220°C, making it difficult to take advantage of the characteristics of SiC power semiconductors, which can operate at high temperatures of 200°C or higher.…”

Section: Introductionmentioning

confidence: 99%

Fabrication of High-Temperature Solder by Zn Plating Films Containing Al Particles

Kobayashi,

Abiko,

Shohji

2023

KEM

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This study investigated the microstructure and melting point of the Zn–Al composite electroplating film. The cross-sectional microstructure and shear strength of the joints made from the plating films were also evaluated. Zn and Al were confirmed in the plating films from initial microstructure observation. The plating film prepared by a plating bath without cationic surfactant melted near the melting point of Zn and the eutectic point of Zn–Al. When jointed at a joining temperature of 443°C, joining pressure of 5 MPa, and holding time of 5 min, multiple intermetallic compounds, Zn–Al eutectic layers, and unreacted Al particles were observed in the joint layer. From quantitative analysis, the multiple intermetallic compounds were estimated to be Zn–Ni and Zn–Al–Ni intermetallic compounds. The shear strength of the joints increased with increasing joining pressure but was lower than that of Sn–5Sb solder. Fracture after the shear test was observed at the interface between unreacted Al particles and Zn–Al–Ni intermetallic compounds, and inside unreacted Al particles.

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