Solid-Liquid InterDiffusion (SLID) Bonding, for Thermally Challenging Applications

Abstract

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Low-temperature Metal Bonding for Optical Device Packaging

“…The solid-liquid interdiffusion (SLID) bonding method is a wafer-level metal bonding process that could be done at a low temperature [3], [6]. The process involves the interdiffusion of base metals to form an intermetallic compound (IMC) that results in a bonded structure with a higher remelting temperature than the bonding temperature [7], [8]. Furthermore, it is compatible with hermetic encapsulation and vertical interconnects, which are very attractive for 3D MEMS development, as illustrated in Fig.…”