Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems

Baheti, Varun A.; Kashyap, Sanjay; Kumar, Praveen; Chattopadhyay, K.; Paul, Aloke

doi:10.1016/j.jallcom.2017.08.178

Cited by 43 publications

(10 citation statements)

References 21 publications

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“…Also this observation is consistent with the literature. [4][5][6][7] The evaluation of the EDS measurements (Fig. 2a, b, and c) shows that no considerable differences in the compositions of the intermetallic phases can be observed for the different specimens.…”

Section: Resultsmentioning

confidence: 93%

“…The addition of minor amounts of Ni to Cu is widely reported to have a strong influence on the phase composition and, in particular, on the phase formation kinetics, affecting the microstructure considerably. [1][2][3][4][5][6][7][8][9] The phase formation scheme remains the same, but it has been reported that Ni promotes growth of the g phase at the cost of the e phase. Moreover, Ni is often added to solder pastes and its influence on intermetallic formation was also investigated in different research works.…”

Section: Introductionmentioning

confidence: 99%

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Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

Wieser

Hügel

Martin

et al. 2020

Journal of Elec Materi

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A current issue in electrical engineering is the enhancement of the quality of solder joints. This is mainly associated with the ongoing electrification of transportation as well as the miniaturization of (power) electronics. For the reliability of solder joints, intermetallic phases in the microstructure of the solder are of great importance. The formation of the intermetallic phases in the Cu-Sn solder system was investigated for different annealing temperatures between 472 K and 623 K using pure Cu as well as Cu-1at.%Ni and Cu-3at.%Ni substrate materials. These are relevant for lead frame materials in electronic components. The Cu and Cu-Ni alloys were in contact to galvanic plated Sn. This work is focused on the unexpected formation of the hexagonal ζ-(Cu,Ni)10Sn3 phase at annealing temperatures of 523–623 K, which is far below the eutectoid decomposition temperature of binary ζ-Cu10Sn3 of about 855 K. By using scanning electron microscopy, energy dispersive X-ray spectroscopy, electron backscatter diffraction and X-ray diffraction the presence of the ζ phase was confirmed and its structural properties were analyzed.

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Section: Resultsmentioning

confidence: 93%

Section: Introductionmentioning

confidence: 99%

Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

Wieser

Hügel

Martin

et al. 2020

Journal of Elec Materi

View full text Add to dashboard Cite

show abstract

“…The Arrhenius relationship (involving the pressure ( P ) and diffusion coefficient ( D ) of the atoms [ 28 ]) with Q as the activation energy for diffusion can be expressed as [ 29 ]:

where R is the gas constant, T is the temperature of the melt (K), P is pressure, and no change in V . When high pressure is applied (at the GPa level), the ratio between D p and D 0 (i.e., the diffusion coefficients under high and atmospheric pressures) can be expressed as:

…”

Section: Resultsmentioning

confidence: 99%

Annealing of Al-Zn-Mg-Cu Alloy at High Pressures: Evolution of Microstructure and the Corrosion Behavior

Suo

Jia

et al. 2021

Materials

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Extruded Al-Zn-Mg-Cu alloy samples with grains aligned parallel to the extrusion direction were subjected to high-pressure annealing. The effects of annealing pressure on the microstructure, hardness, and corrosion properties (evaluated using potentiodynamic polarization (PDP) and electrochemical impedance spectroscopy (EIS)) were investigated. Phase analysis showed the presence of MgZn2 and α-Al phases, the MgZn2 phase dissolved into the matrix, and its amount decreased with the increasing annealing pressure. The recrystallization was inhibited, and the grains were refined, leading to an increase in the Vickers hardness with increasing the annealing pressure. The corrosion resistance was improved after high-pressure treatment, and a stable passivation layer was observed. Meanwhile, the number of corrosion pits and the width of corrosion cracks decreased in the high-pressure annealed samples.

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“…However, by such sample treatment method, thin oxide layer was observed between two reaction components which would act as a diffusion barrier between them [15]. Moreover, in such method each diffusion couple would go through an uncertain nucleation incubation period which would be counted into the total aging time in subsequent kinetic analysis [16]. According to Dybkov's modeling [17], if two reaction components were perfectly bonded (metallurgically bonded without any IMC formation), at the beginning stage of aging, the growth behavior of a single IMC layer would obey a linear law rather than a parabolic one.…”

Section: Interfacial Morphology Evolution Of Solder Jointsmentioning

confidence: 99%

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

Wang

Chen

Liu

2020

Acta Metall. Sin. (Engl. Lett.)

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A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 °C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n ≈ 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress.

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Solid–state diffusion–controlled growth of the intermediate phases from room temperature to an elevated temperature in the Cu–Sn and the Ni–Sn systems

Cited by 43 publications

References 21 publications

Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

Stabilization of the ζ-Cu10Sn3 Phase by Ni at Soldering-Relevant Temperatures

Annealing of Al-Zn-Mg-Cu Alloy at High Pressures: Evolution of Microstructure and the Corrosion Behavior

Influence of External Interface Normal Stress on the Growth of Cu–Sn IMC During Aging

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