Solid-State Qubits: 3D Integration and Packaging

Rosenberg, Danna; Weber, Steven; Conway, David; Yost, D.; Mallek, Justin; Calusine, Gregory; Das, Rabindra Nath; Kim, David; Schwartz, Maurice L.; Woods, Wayne; Yoder, Jonilyn; Oliver, William

doi:10.1109/mmm.2020.2993478

Cited by 47 publications

(29 citation statements)

References 64 publications

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“…Air bridges over cavities are proposed to connect both sides of ground planes to improve the distribution of current density. 83,85 Air bridges also facilitate two cavities crossing each other and provide a geometric flexibility for quchip layout. 85 One disadvantage of coplanar cavities is that more than 80% of electrical field travels through the dissipative silicon substrate resulting in energy loss.…”

Section: Geometric Considerationsmentioning

confidence: 99%

“…83,85 Air bridges also facilitate two cavities crossing each other and provide a geometric flexibility for quchip layout. 85 One disadvantage of coplanar cavities is that more than 80% of electrical field travels through the dissipative silicon substrate resulting in energy loss. Comparing with cylindrical 3D cavities, the resonance lifetime is about one magnitude of order shorter.…”

Section: Geometric Considerationsmentioning

confidence: 99%

“…A cavity can span across a STSV and still maintain very high resonance quality. 85 Large numbers of STSV's are used to connect ground plans on both sides. A silicon substrate with 200 lm thickness has proved to be thick enough to provide a proper distance so that crosstalk between circuits on top and bottom can be minimized.…”

Section: Qpu-3d Integrationsmentioning

confidence: 99%

“…Layers of switching and routing circuitry for microwave signals can be 3D-integrated with qubit layers, too. 85 Control/readout signals and bias DC lines from QPU can be connected to multi-layer PCB's for on-board signal processing or transmitted to external data collectors. 85 There are proposals suggesting that some classical functions, such as sequence timers be integrated inside QPU.…”

Section: Qpu-3d Integrationsmentioning

confidence: 99%

“…85 Control/readout signals and bias DC lines from QPU can be connected to multi-layer PCB's for on-board signal processing or transmitted to external data collectors. 85 There are proposals suggesting that some classical functions, such as sequence timers be integrated inside QPU. More research is needed for digital circuits working in qubit cryostats and thermal noise issues.…”

Section: Qpu-3d Integrationsmentioning

confidence: 99%

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Cryogenic Materials and Circuit Integration for Quantum Computers

Chien

Jhan

Chiu

et al. 2020

Journal of Elec Materi

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Over the last decade, quantum computing has experienced significant changes and captured worldwide attention. In particular, superconducting qubits have become the leading candidates for scalable quantum computers, and a number of cryogenic materials have scientifically demonstrated their potential uses in constructing qubit chips. However, because of insufficient coherence time, establishing a robust and scalable quantum platform is still a long-term goal. Another consideration is the control circuits essential to initializing, operating and measuring the qubits. To keep noise low, control circuits in close proximity to the qubits require superior reliability in the cryogenic environment. The realization of the quantum advantage demands qubits with appropriate circuitry designs to maintain long coherence times and entanglement. In this work, we briefly summarize the current status of cryogenic materials for qubits and discuss typical cryogenic circuitry designs and integration techniques for qubit chips. In the end, we provide an assessment of the prospects of quantum computers and some other promising cryogenic materials.

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Section: Geometric Considerationsmentioning

confidence: 99%

Section: Geometric Considerationsmentioning

confidence: 99%

Section: Qpu-3d Integrationsmentioning

confidence: 99%

Section: Qpu-3d Integrationsmentioning

confidence: 99%

Section: Qpu-3d Integrationsmentioning

confidence: 99%

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