“…The advancement towards the 65 nm resolving power is associated with exceptional complication of the requirements to the protective groups; these groups must make contribution to balancing a number of properties of photoresists such as high light sensitivity, stability during plasma chemical etching, resolving power, and irregularity of the image edge. For the development of the latest generation positive resists for nanolithography based on 193 nm radiation, a new approach was proposed that distributed these tasks between two chemically different protecting groups [3].…”