2001 IEEE EMC International Symposium. Symposium Record. International Symposium on Electromagnetic Compatibility (Cat. No.01CH
DOI: 10.1109/isemc.2001.950481
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Solution of large differential signal problem using two different integral equation based methods

Albert E. Ruehli
1
,
J. Esch2,
Junsheng Zhao
3
et al.
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Cited by 4 publications
(1 citation statement)
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“…"Differential Pair over Split Plane" [10] (Fig. 3, top) is used to test the coupled solver and also to compare the simulation with that from PEEC modeling technique [11]. …”
Section: Numerical Resultsmentioning
confidence: 99%

A time-domain surface integral technique for mixed electromagnetic and circuit simulation

Yang
1
,
Jandhyala
2
2005
IEEE Trans. Adv. Packag.
20
0
0
0
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“…"Differential Pair over Split Plane" [10] (Fig. 3, top) is used to test the coupled solver and also to compare the simulation with that from PEEC modeling technique [11]. …”
Section: Numerical Resultsmentioning
confidence: 99%

A time-domain surface integral technique for mixed electromagnetic and circuit simulation

Yang
1
,
Jandhyala
2
2005
IEEE Trans. Adv. Packag.
20
0
0
0
View full textAdd to dashboardCite

A time domain surface integral technique for mixed electromagnetic and circuit simulation

Yang
1
,
Jandhyala
2
Electrical Performance of Electronic Packaging,
6
0
0
0
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Toward a more robust and accurate CEM fast Integral equation solver for IC applications

Chew
1
,
Jiang2,
Chu
3
et al. 2005
IEEE Trans. Adv. Packag.
14
0
0
0
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