Soy flour dispersibility and performance as wood adhesive

Frihart, Charles R.; Satori, Holly

doi:10.1080/01694243.2012.696948

Cited by 56 publications

(47 citation statements)

References 15 publications

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“…The bonding strength of a protein adhesive depends on the interaction of the hydrophobic and hydrophilic groups of the protein with the wood material (Kumar et al 2002). Protein dispersibility index (PDI) and particle size do not influence the adhesion of soy flour adhesives to wood surfaces (Frihart and Satori 2013). Native soy proteins have a highly ordered global structure.…”

Section: Introductionmentioning

confidence: 99%

Thermal modification of soy proteins in the vacuum chamber and wood adhesion

Vnučec¹,

Goršek

Kutnar

et al. 2014

Wood Sci Technol

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Adhesives based on renewable resources have inferior efficiency compared to the synthetic ones. To improve the adhesive properties of soy protein isolate (SPI) adhesives, a new method of thermally modifying SPI was developed. The commercial SPI powder was thermally modified in a vacuum chamber at different temperatures (50, 100, 150, and 200°C). Thermally modified and unmodified SPI powders were dispersed in distilled water and stirred at 24, 50 or 90°C. Dispersions were prepared without and with pH adjustment to 10.0. The viscosity of the resulting adhesives was measured. Effective penetration and bond strength in longitudinal tensile shear were tested with bonded beech specimens. Regardless of the pH value and dispersion preparation temperature, SPI thermally modified at 150 and 200°C exhibited no adhesive properties, while adhesive bonding was achieved with SPI modified at 50 and 100°C. Adhesives without pH adjustment had viscosity below 28 mPas and exhibited no adhesive penetration. pH adjustment increased the viscosity and adhesive penetration, which improved the adhesive bond strength. Thermal modification at 50°C resulted in improved wet shear strength, while the temperature of 100°C deteriorated it. Increased dispersion preparation temperature to 50°C increased wet shear strength, while temperature of 90°C decreased it. The combination of thermal modification at 50°C, dispersion preparation at 50°C, and pH increase resulted in an adhesive with the highest shear strength.

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Section: Introductionmentioning

confidence: 99%

Thermal modification of soy proteins in the vacuum chamber and wood adhesion

Vnučec¹,

Goršek

Kutnar

et al. 2014

Wood Sci Technol

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“…Previously we had shown that phosphorylation of SF using POCl 3 at a POCl 3 -to-SF weight ratio of 0.15 (g/g) provided a PSF adhesive, designated as PSF0. 15, with a maximum wet bonding strength [13]. Briefly, a 15 % (w/w) dispersion of SF in water at pH 10.5 was stirred for 60 min at 60 °C to partially denature proteins.…”

Section: Phosphorylation Of Sfmentioning

confidence: 99%

“…An automated bond evaluation system (ABES) (Model 311c tester, Adhesive Evaluations Systems Inc., Corvallis, OR) was used to determine the bonding strength of adhesives in maple veneers [13,[15][16][17]. Maple veneers (0.8 mm thick; Columbia Forest Products, Old Fort, NC) were equilibrated at 21 °C and 50 % relative humidity for at least 24 h and cut into strips of 11.7 cm along the grain and 2 cm across the grain.…”

Section: Bonding Strength Measurementmentioning

confidence: 99%

“…Although there are no shear strength requirements for interior used type II plywood according to the ANSI/HPVA HP-1 standard, we determined the wet shear strength of three-ply plywood bonded with the various adhesives and the results are shown inTable 3. After 24 h soaking in water at room temperature, the wet shear strength of the three-ply plywood was 1.54 MPa for the PSF0 15. + 1.8 % Ca(NO 2 ) 2 + 0.8 % EC formulation; 0.8 MPa for the PSF0.15 + 0.8 % NaClO 2 + 1.4 % CaCl 2 formulation; and 0.1 MPa for the SF-only formulation.…”

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confidence: 99%

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A Formaldehyde‐Free Water‐Resistant Soy Flour‐Based Adhesive for Plywood

Damodaran

Zhu

2016

J Americ Oil Chem Soc

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The phasing out of the use of urea–formaldehyde adhesive in the fabrication of interior‐used hardwood plywood requires development of environmentally friendly bio‐based wood adhesives. We recently reported that phosphorylation of soy flour (SF) using phosphoryl chloride (POCl3) greatly improved the moisture resistance of soy flour adhesive. In the present study, we investigated the effects of inorganic oxidizing agents, such as NaClO2 and Ca(NO2)2, to further improve the wet bonding strength of phosphorylated SF (PSF) wood adhesive. We report that addition of 1.8 % (wet weight basis) Ca(NO2)2 to phosphorylated SF (PSF) adhesive formulation containing 25 % soy flour solids increased the wet bonding strength to greater than 3 MPa at 140 °C hot‐press temperature. The water resistance testing of the glued three‐ply hardwood plywood panels passed the three‐cycle soak/dry test recommended by the American National Standard for Hardwood and Decorative Plywood/Hardwood Plywood and Veneer Association protocol (ANSI/HPVA HP‐1‐2004). Since the process involves only inorganic chemistry and no petroleum‐based chemicals such as formaldehyde or polyamidoamine–epichlorohydrin are used, the PSF + Ca(NO2)2 adhesive is non‐toxic and environmentally safe.

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“…To meet with the requirements on mechanical performances and water resistance, soy protein-based adhesives normally has to be modified with some cross-linkers, such as formaldehyde and its derivatives, isocyanate, epoxy, etc. [4][5][6][7][8][9]. The modification mechanism was presumed to be based on the reaction between the cross-linkers and the reactive groups from protein molecules, which including -NH 2 , -CO-NH-, -CO-NH 2 , -COOH, -OH, -SH, and -Ph-OH [10][11][12].…”

Section: Introductionmentioning

confidence: 99%

The Reaction between Furfuryl Alcohol and Model Compound of Protein

Liang

Lei

et al. 2017

Polymers

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Abstract:To guide the preparation of protein-based adhesive, especially the soy-based adhesive, the reaction between a simple dipeptide N-(2)-L-alanyl-L-glutamine (AG), being used as a model compound of protein, and its cross-linker furfuryl alcohol were studied in this paper. The products that were prepared with furfuryl alcohol and AG under different pHs were analyzed by ESI-MS, 13 C NMR, and FT-IR. It was found that the medium environment had great effects on the competition of the co-condensation reaction between furfuryl alcohol and AG and self-condensation reaction of furfuryl alcohol molecules in the mixing system with furfuryl alcohol and AG. Under alkaline conditions, both co-and self-condensation were not obviously detected. Only when the value of pH was higher than 11, were a few co-condensation reaction products gotten. The reaction occurred mainly between furfuryl alcohol and the primary amido groups of AG. Under acid conditions, both co-and self-condensation were observed. The more acid the preparation conditions were, the easier to be observed the self-condensation of furfuryl alcohol molecules would be than the co-condensation between furfuryl alcohol and AG. When the value of pH was higher than 5, both coand self-condensation were not outstanding. In this study, under pH 3, the co-and self-condensation found equilibrium. There was a great possibility for the primary amido and aliphatic amino groups of AG molecules to react with furfuryl alcohol molecules. No reaction was detected between the secondary amido groups of AG and furfuryl alcohol.

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Soy flour dispersibility and performance as wood adhesive

Cited by 56 publications

References 15 publications

Thermal modification of soy proteins in the vacuum chamber and wood adhesion

Thermal modification of soy proteins in the vacuum chamber and wood adhesion

A Formaldehyde‐Free Water‐Resistant Soy Flour‐Based Adhesive for Plywood

The Reaction between Furfuryl Alcohol and Model Compound of Protein

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