Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling

Zhao, Shenghao; Pang, K. P.; Huang, Ya-Ning; Xiao, Ning

doi:10.1080/00202967.2019.1636581

Cited by 8 publications

(5 citation statements)

References 15 publications

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“…It was also noticed that the polarization curves of 10 and 20 ppm were not smooth lines, which existed a break point or even a peak as highlighted by a red arrow in figure 9(a). The electrochemical behavior of SH110 during ordinary copper electroplating reported in literature previously [22] was consistent with our measurement. In detail, the SH110 would decompose into accelerator 3-mercapto-1-propanesulphonate (MPS) and leveler 2-thiazonline-2-thiol (H1) during ordinary copper electroplating.…”

Section: Discussionsupporting

confidence: 93%

“…On the other hand, the H1 acted as a leveler and adsorbed on the copper surfaces. The molecular structure changed to thiazolinyl-S-Cu (H1-Cu) of which thiazoline-ring was approximately parallel to the copper surface [22]. The bottom of RDL possessed relatively weak convection and low current density, while the top of RDL possessed strong convection and high current density.…”

Section: Discussionmentioning

confidence: 99%

“…Wang et al [21] studied the adsorption behavior of SH110 on the copper surface by molecular dynamics, and indicated the through-hole filling without any voids could be achieved with SH110 as single additive. Zhao et al [22] used the galvanostatic measurement (GM) to analyze the electrochemical behavior of SH110 and found the critical concentration of SH110 to complete superfilling. Above all, the usage of SH110 was helpful to improve the filling ability for electroplating ordinary copper.…”

Section: Introductionmentioning

confidence: 99%

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Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)

Huang¹,

Gao²,

Peng³

et al. 2022

Nanotechnology

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Nanotwinned copper is a potential microelectronic interconnected material due to its superior strength and conductivity, however, its filling ability is urgently needed to improve before application in the field of advanced packaging. The effect of additive (sodium thiazolinyl dithiopropane sulphonate, SH110) addition on the surface roughness, microstructure, mechanical properties and filling capacity of nanotwinned copper films was investigated. The surface roughness and grain size were firstly reduced then increased with the increasing concentrations of SH110, reaching the minimum value at 10 ppm. It was noticed that copper films with 10ppm SH110 also possessed superior tensile strength and elongation, which were measured as 481 MPa and 3.68% on average of 12μm-thick samples by dynamic thermo-mechanical analyzer (DMA). Further, their uniformity and flatness of redistributed layers (RDLs) were controlled as 2% and 1.9%, which were significantly improved compared to the samples without SH110 (7.6% and 4.7%). As demonstrated by Linear Sweep Voltammetry (LSV) analysis and Galvanostatic Measurement (GM), the SH110 could cooperate well with gelatin and serve as a combination of accelerator and leveler, resulting in the improvement of filling capacity for nanotwinned copper RDLs.

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Section: Discussionsupporting

confidence: 93%

Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)

Huang¹,

Gao²,

Peng³

et al. 2022

Nanotechnology

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show abstract

“…So, the addition of SH110 enables depolarization of copper deposition. With a SH110 concentration increase, the concentration of inhibitor fragments decomposed by SH110 gradually increased, and the cathodic polarization increased [30,31]. Different potential changes were gradually displayed under strong and weak convection.…”

Section: Bath Solution Designmentioning

confidence: 97%

“…The role of the accelerator includes the acceleration of the copper deposition rate, promoting the formation of copper crystal nucleus, thus improving the uniformity of the copper layer. At present, SPS, MPS, SH110, etc., were widely used as the accelerator in plating [30]. Wang et.al.…”

Section: Bath Solution Designmentioning

confidence: 99%

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Li³

et al. 2022

Coatings

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The uniformity and microstructure of the copper deposition in the high aspect ratio plated through holes (penetrating holes) are crucial for the performance of printed circuit board. We systematically investigated the effects of reverse pulse parameters in the period pulse reverse (PPR) plating on the uniformity and microstructure of the copper deposition, including reverse pulse frequency, reverse pulse duty cycle and reverse pulse current density. The Cu deposition behavior (throwing power) and its crystallographic characteristics, including grain size, crystallographic orientation, and grain boundary, were characterized by means of field-emission scanning electron microscopy (FE-SEM), X-ray diffractometer (XRD), and electron backscatter diffraction (EBSD). Our results clarify that the reverse pulse current density and duty ratio should be low to achieve the full filling and high uniformity of the through holes. The reverse pulse frequency of 1500 Hz would prevent the through holes to be fully filled. The copper electrodeposition in PTH prepared by double pulse electrodeposition has the good (111) surface texture and grain boundary distribution. This work demonstrated that the period pulse reverse (PPR) plating provides unique advantages in achieving the ultra-uniform copper deposition in the high aspect ratio plated through holes.

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Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

Xiao

Sun

Bai³

et al. 2023

J Appl Electrochem

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Special electrochemical behaviour of sodium thiazolinyl-dithiopropane sulphonate during microvia filling

Cited by 8 publications

References 15 publications

Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)

Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL)

Ultra-Uniform Copper Deposition in High Aspect Ratio Plated through Holes via Pulse-Reverse Plating

Effect of additives on microstructure and properties of the coarsened layer of very low profile (HVLP) copper foil

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