2022
DOI: 10.3390/mi13040603
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Special Issue on Miniaturized Transistors, Volume II

Abstract: Due to the great success of the initial Special Issue on Miniaturized Transistors [...]

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(2 citation statements)
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“…Side effects caused by electromagnetic or thermal effects may also occur, resulting in malfunctions or thermomechanical stresses and distortions. At the same time, understanding the processes of interaction of ionizing radiation on semiconductor devices, as well as microelectronic devices, is very important for the design and development of electronic devices, and therefore, much attention has been paid to this area in recent years [ 8 , 9 , 10 ]. Note that while the processes of radiation damage are fairly well understood in binary oxides and halides [ 11 , 12 , 13 , 14 , 15 , 16 , 17 ], the situation in multicomponent glasses is still far from detailed [ 18 , 19 , 20 ].…”
Section: Introductionmentioning
confidence: 99%
“…Side effects caused by electromagnetic or thermal effects may also occur, resulting in malfunctions or thermomechanical stresses and distortions. At the same time, understanding the processes of interaction of ionizing radiation on semiconductor devices, as well as microelectronic devices, is very important for the design and development of electronic devices, and therefore, much attention has been paid to this area in recent years [ 8 , 9 , 10 ]. Note that while the processes of radiation damage are fairly well understood in binary oxides and halides [ 11 , 12 , 13 , 14 , 15 , 16 , 17 ], the situation in multicomponent glasses is still far from detailed [ 18 , 19 , 20 ].…”
Section: Introductionmentioning
confidence: 99%
“…4 The rise in device variability worsens the electrostatic integrity of memory devices. 5 furthermore, there lie multiple reliability concerns, e.g. Hot Carrier Injection (HCI), 6 Bias Temperature Instability (BTI), 7,8 radiation damage, 11 and Time-Dependent Dielectric Breakdown (TDDB).…”
mentioning
confidence: 99%