“…As it is shown in Górecki et al (2019) and Górecki et al (2019a), these processes can cause changes in the course of characteristics of such devices. Additionally, during operation of semiconductor devices their internal temperature increases as a result of both: an increase in ambient temperature and self-heating phenomena (Zarębski and Górecki, 2007; Górecki and Górecki, 2017; Mawby et al , 2001; Zarębski and Górecki, 2009; Janicki et al , 2014). This phenomena are caused by an exchange of electrical energy dissipated in this device into heat at not ideal removal of heat to the surroundings (Górecki et al , 2017; Zarębski and Górecki, 2007; Górecki and Górecki, 2017; Wu et al , 2016; Hapka et al , 2012; Mawby et al , 2001; Zarębski and Górecki, 2009).…”