2010 53rd IEEE International Midwest Symposium on Circuits and Systems 2010
DOI: 10.1109/mwscas.2010.5548881
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SPICE simulation of nanoscale non-crystalline silicon TFTs in spiking neuron circuits

Abstract: Electrical characteristics of nano-crystalline silicon (nc-Si) thin-film transistors (TFTs) are fit using SPICE device models. The corresponding device model geometry is then extrapolated down to submicron dimensions using electrical data measured on a-Si:H transistors as justification. The nanoscale devices are then used to simulate a spiking neuron circuit. The frequency of output voltage pulses in the circuit is a function of the input current. Various loads are added to the output to represent driving of m… Show more

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Cited by 12 publications
(3 citation statements)
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“…Moreover, the maximum frequency of a biological neuron may reach several hundred hertz (i.e. milliseconds) [50], whereas the SET model designed in Ref. [21] cannot emulate this situation well.…”
Section: Parameter Settings Of the Primary Nanoscale Devicesmentioning
confidence: 99%
“…Moreover, the maximum frequency of a biological neuron may reach several hundred hertz (i.e. milliseconds) [50], whereas the SET model designed in Ref. [21] cannot emulate this situation well.…”
Section: Parameter Settings Of the Primary Nanoscale Devicesmentioning
confidence: 99%
“…1a, which is a heavily modified version of that originally proposed by Mead [17]. The TFT and memristor models have been discussed extensively in previous work [18,19] in which each synapse consisted of one TFT and one memristor. Here, the synapse has been simplified to a single memristor whose state variable w/D (definition provided in [1]) represents the synaptic weight.…”
Section: Device Modelsmentioning
confidence: 99%
“…Fabrication of nanoscale TFTs has been demonstrated using electron beam lithography (EBL) [9]. Submicron device dimensions are essential for use in high-density architectures such as neuromorphic systems [17]. In addition, nc-Si TFTs can be fabricated at temperatures of 250 ∘ C and below, allowing the incorporation of alternative substrates including polyimide [18] and steel foil [19].…”
Section: Introductionmentioning
confidence: 99%