Spontaneous Potential Oscillation Resulting in Copper Deposit with Ultra-Large Grains

Chan, Po-Fan; Dow, Wei‐Ping

doi:10.1149/2.1181914jes

Cited by 10 publications

(9 citation statements)

References 33 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The method and the mechanism of electroforming a ULG Cu foil was described in a previous paper. 31 It is worth noting that the ULG Cu was generated directly through electrodeposition without any annealing assistance. The crosssectional focused ion beam (FIB) image of the ULG Cu foil is shown in Figure 5A.…”

Section: ■ Experimental Sectionmentioning

confidence: 99%

“…The copper microstructures obtained in this study were the structures containing normal grains with twinned boundaries (TB) (see Figure A,B), the ultralarge grain (ULG) with TB (see Figure C), and the ULG crystal (see Figure D). The method and the mechanism of electroforming a ULG Cu foil was described in a previous paper . It is worth noting that the ULG Cu was generated directly through electrodeposition without any annealing assistance.…”

Section: Experimental Sectionmentioning

confidence: 99%

See 1 more Smart Citation

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Chan

Lee

Wen

et al. 2020

ACS Appl. Electron. Mater.

Self Cite

View full text Add to dashboard Cite

For pursuing a more comprehensive mechanism of void formation at the Sn/Cu interface, different grain size Cu samples with and without twinned boundaries are electrodeposited for the Sn/Cu joint and the IMC analysis. The formation of voids in the Sn/Cu joint is divided into three parts for discussion: Cu diffusion, Sn diffusion, and impurity diffusion. For the void formation at the Cu/Cu3Sn interface, the concept of the mechanism is from the Kirkendall effect, which is specially focused on the speed difference of Cu diffusion between at the Cu grain boundary and in the copper lattice in this study. The speed difference caused the vacancy formation. Impurities also play an important role in promoting the vacancy aggregation from a cluster to a void. Whether it is a diffusion effect or an impurity effect, it occurs at a Cu grain boundary. The voids would be formed when the density of the Cu grain boundary is high. The grain size of Cu is inversely proportional to the density of the Cu grain boundary; as a result, Cu grain size strongly affects the interfacial microstructure of a Sn/Cu joint, that is, the larger the Cu grain size is, the less the void at the Sn/Cu interface will be formed.

show abstract

Section: ■ Experimental Sectionmentioning

confidence: 99%

Section: Experimental Sectionmentioning

confidence: 99%

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Chan

Lee

Wen

et al. 2020

ACS Appl. Electron. Mater.

Self Cite

View full text Add to dashboard Cite

show abstract

“…Tuning this dynamic property (oscillation period) by the presence of chemical additives has been systematically investigated in the oscillatory electrodeposition of copper in acidic solutions. − The galvanostatic oscillations arise from an intricate interplay between the suppressors or levelers (e.g., polymerizates of imidazole and epichlorohydrin (Imep), benzyl viologen, or 1,1-bis(phenylmethyl)-4,4-bipyridinium (BV), etc.) and the accelerators (e.g., bis(sodium sulfopropyl) disulfide (SPS), mercaptopropanesulfonic acid/sulfonate (MPS), etc.).…”

Section: Resultsmentioning

confidence: 99%

“…and the accelerators (e.g., bis(sodium sulfopropyl) disulfide (SPS), mercaptopropanesulfonic acid/sulfonate (MPS), etc.). According to the literature, the poly(alkylene glycol)s, chloride ions, among others, participate as coadditives, playing no effect in the emergence of dynamic instabilities. , As highlighted by Haubner et al the mechanism that drives the galvanostatic oscillations is still under debate and different proposals seem to be contradictory. One of the key species that is formed by the complexation reactions with Cu(I), such as Imep-Cu(I)-MPS or chloride-Cu(I)-MPS, can activate the electrodeposition reaction, then decreasing the oscillation period.…”

Section: Resultsmentioning

confidence: 99%

Influence of the Ligands in Cu(II) Complexes on the Oscillatory Electrodeposition of Cu/Cu₂O

et al. 2020

View full text Add to dashboard Cite

Oscillatory electrodeposition reactions have been utilized to create nanostructured materials under the microscale and nanoscale. This alternative method of synthesis, when compared to the traditional step-by-step synthesis procedure, takes advantage of the self-organizing processes that do not require any external control or template-based support, resulting in materials with higher complexity in terms of structure and composition. Nanolayers made of Cu and semiconductor composites, such as Cu/Cu2O, can be finely tuned by controlling ordinary period-one oscillations in the cathodic deposition. As the reaction media is alkaline, a complexing agent is commonly added in the solution to prevent the precipitation of the copper ions as hydroxides. Lactate and tartrate molecules are two α-hydroxy carboxylate organic ligands extensively used for this aim. Although some studies have shown the electrochemical synthesis of Cu/Cu2O nanolayers, no grounded discussion about the influence of the chemical nature of the ligands on the oscillatory reaction has been investigated so far. Here, we provide a well-detailed and rigorous study of the effect of both ligands in the electrodeposition of Cu/Cu2O under galvanostatic control, accurately mapping differences in the oscillation period and amplitude. On the basis of recent advances on the understanding of the copper complex structures, we attributed a distorted tetrahedral structure with four monodentate lactate ligands linked to the Cu2+ central ion ([Cu(Lac)4]2–) and a distorted square-planar coordination of the tartrate’s deprotonated alkoxide groups, forming a chelate ([Cu(TartH–2)2]6–), as the species that have a buffering effect on the oscillatory mechanism and, consequently, can control the extension of the oscillation period and amplitude. In this matter, the tartrate complex should have a higher buffering capacity to prolong the period and decrease the amplitude. More importantly, we unequivocally show that a surface blocking effect due to the adsorption reactions cannot be neglected in the mechanism description. The adsorption of the tartrate anions and its complexes has, also as an outcome, period enlargement and amplitude shrinkage, as compared to that of the lactate. Hence, both mechanisms seem to operate in the adjustment of the dynamic characteristics of the oscillatory electrodeposition of Cu/Cu2O.

show abstract

“…At present, the Belousov-Zhabotinsky (B-Z) oscillation reaction is most widely used in analysis and detection, followed by the copper ion oscillation system (Alfifi et al, 2016;Luiz Fernando Oliveira Maia et al, 2019;Nawabi et al, 2019;Ullah et al, 2019). There are also Bray-Liebhafsky oscillation reaction, Briggs-Rauscher oscillation reaction, peroxidaseoxidase biochemical oscillator (peroxidase-oxidase oscillation system), and liquid membrane oscillator (Mukouyama et al, 2016;Bai et al, 2017;Peng et al, 2017;Chan and Dow, 2019;Ding et al, 2019). The basis for applying chemical oscillation reaction to analysis and detection is that the substance to be tested can interfere with the oscillation reaction.…”

Section: Introductionmentioning

confidence: 99%

Development of Electrochemical Oscillation Method for Identification of Prunus persica, Prunus davidiana, and Prunus armeniaca Nuts

Yan

Yue

et al. 2020

Front. Chem.

View full text Add to dashboard Cite

In this work, an electrochemical oscillation system has been developed using the Belousov-Zhabotinsky reaction. The effect of the combination of each reagent, reaction temperature, and stirring speed on the induction period, oscillating period, and oscillating life were optimized. The nuts of Prunus persica, Prunus davidiana, and Prunus armeniaca have been widely used for medical purposes. The proposed electrochemical oscillation system was then used for the identification of P. persica, P. davidiana, and P. armeniaca. Three nuts exhibited very different electrochemical oscillation profiles. The dendrogram was divided into three main principal infrageneric clades. Each cluster only contains one species, suggesting that no outlier was observed in this study. Based on the discussed results, we proposed a simple method for herbal medicine identification.

show abstract

Spontaneous Potential Oscillation Resulting in Copper Deposit with Ultra-Large Grains

Cited by 10 publications

References 33 publications

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Influence of the Ligands in Cu(II) Complexes on the Oscillatory Electrodeposition of Cu/Cu₂O

Development of Electrochemical Oscillation Method for Identification of Prunus persica, Prunus davidiana, and Prunus armeniaca Nuts

Contact Info

Product

Resources

About

Spontaneous Potential Oscillation Resulting in Copper Deposit with Ultra-Large Grains

Cited by 10 publications

References 33 publications

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Effect of Copper Grain Size on the Interfacial Microstructure of a Sn/Cu Joint

Influence of the Ligands in Cu(II) Complexes on the Oscillatory Electrodeposition of Cu/Cu2O

Development of Electrochemical Oscillation Method for Identification of Prunus persica, Prunus davidiana, and Prunus armeniaca Nuts

Contact Info

Product

Resources

About

Influence of the Ligands in Cu(II) Complexes on the Oscillatory Electrodeposition of Cu/Cu₂O