Spray cooling at low system pressure

Marcos, A.; Chow, L. C.; Du, Jianhua; Lei, Shu-Ye; Rini, Daniel P.; Lindauer, J.J.

doi:10.1109/stherm.2002.991364

Cited by 12 publications

(6 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…However, the flash evaporation spray cooling accompanied with phase transition has latent heat of vaporization, which can reach the maximum heat dissipating capacity of the working medium. Marcos et al [43] proved through an experiment that flash evaporation spray cooling has higher coefficient of heat transfer compared with the traditional spray cooling oil. Besides, the flash evaporation spray cooling can lower temperature of the cooled surface effectively.…”

Section: Study On Applications Of Flashmentioning

confidence: 99%

Research Progresses of Flash Evaporation in Aerospace Applications

Ma¹,

Zhai

Zhang

et al. 2018

International Journal of Aerospace Engineering

View full text Add to dashboard Cite

Liquid is overheated and evaporated quickly when it enters into the environment with lower saturation pressure than that corresponding to its initial temperature. This phenomenon is known as the flash evaporation. A natural low-pressure environment and flash evaporation have unique characteristics and superiority in high altitude and outer space. Therefore, flash evaporation is widely used in aerospace. In this paper, spray flash evaporation and jet flash evaporation which are two different forms were introduced. Later, key attentions were paid to applications of flash evaporation in aerospace. For example, the flash evaporation has been used in the thermal control system of an aircraft and the propelling system of a microsatellite and oil supply system of a rocket motor. Finally, the latest progresses in the calculation model and numerical simulation of flash evaporation were elaborated.

show abstract

Section: Study On Applications Of Flashmentioning

confidence: 99%

Research Progresses of Flash Evaporation in Aerospace Applications

Ma¹,

Zhai

Zhang

et al. 2018

International Journal of Aerospace Engineering

View full text Add to dashboard Cite

show abstract

“…Furthermore, in this special case, the SMD (i.e., D 32 ) can be clearly represented by the ratio of the single droplet volume (V)/surface area (A): D 32 = 6×(V/A), according to previous Eqs. 1and (2). Based on this concept of the ratio of V/A, the SMD shows particular significance in some circumstances, where the surface area plays a critical role such as droplet evaporation time in air, as shown in Eq.…”

Section: Droplet Size Distribution and Evaporationmentioning

confidence: 99%

“…To date, droplet evaporative cooling (DEC) has been one of alternative means for reducing temperature of objects at low cost. It has been elaborated in decreasing the hot solid surfaces with high values of CHF of 250-350 W/cm 2 [2,34]. Also, many other efforts have been made in the development of the spatial cooling systems, including the mechanical draft cooling tower and air-conditioning systems [28][29]40], in order to enhance the convective heat transfer in ambient environment.…”

Section: Droplet Evaporative Coolingmentioning

confidence: 99%

“…Over the past 30 years, spray droplets have been investigated and engineered due to their frequent occurrence in nature such as sea water [1] and manual generation on hot surfaces such as liquid deposition [2]. This field of science and engineering has widely demonstrated their significance on thermal and fluidic dynamics, in particular related to cooling and evaporation of spray droplets.…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Generation and Evaporation of Microsprays

Chen¹

2016

Advances in Microfluidics - New Applications in Biology, Energy, and Materials Sciences

View full text Add to dashboard Cite

This chapter aims to comprehensively review the techniques and features of micro-sprays for various applications via micro-droplet generators over decades, especially focusing on the past and present microfluidics. It is organized briefly as below. The background of current research and development about the micro-spray techniques is first introduced, followed by the generation and evaporation of spray detailed with the concentrated respects of critical requirements for materials and facilities. Then, we address the critical design issues of micro-sprayers such as the actuators and nozzles required to be satisfactory for generating a number of droplets. Subsequently, we further describe characterization of droplets in form of spray concerning droplet size, speed, rates, and patterns in microfluidics. Moreover, the chapter presents the proof-of-concept and commercial applications of the micro-spraying processes, highlighting their current technical progresses and future challenges, which shall be intimately related to the droplet generation and evaporation including droplet evaporative cooling, direct printing, screen printing, nanomaterial coating, liquid nebulization, and miscellaneous employment. Finally, we draw a conclusion in the end of the chapter.

show abstract

“…At the microelectronic chip level, two possible approaches to spray cooling are jets [3]- [5] and atomized sprays [6], [7]. Of the cooling approaches reported to date, these two offer the highest heat removal, with atomized spray reported at a critical heat flux of 0.…”

Section: Spray Micro-nozzle Design and Fabricationmentioning

confidence: 99%

Chip-Level Spray Cooling of an LD-MOSFET RF Power Amplifier<tex>$^+$</tex>

Cotler

Brown

Dhir

et al. 2004

IEEE Trans. Comp. Packag. Technol.

View full text Add to dashboard Cite

We report here the application of water spray cooling directly to the top surface of a lateral diffused metal oxide semiconductor field effect transistor (LD-MOSFET) in a 500-MHz RF power amplifier. With the amplifier running in Class A, spray cooling at a flow of 0.14 l/min increases the output power from 66 W to 84 W, and the power-added efficiency increases from 26% to 34%, all at 34 W input. This improvement is attributed to a large spray-induced reduction in junction temperature and total package thermal resistance. At the point of highest measured RF output and dc power dissipation, the reduction in junction temperature and total thermal resistance were estimated to be from 214 C to 115 C and from 1 5 C W to 0 6 C W, respectively, and the maximum spray-induced heat flux was 162 W cm 2 . In Class AB, the increase in output power and power-added efficiency are less, 8%, but the amplifier can be driven harder before failure occurs. The maximum output in class AB is 79 W compared to 70 W without spray cooling.Index Terms-Integrated gate bipolar transistors (IGBTs), low delay metal oxide semiconductor field effect transistor (LD-MOSFET), personal communications service (PCS), power-added efficiency (PAE), solid-state power amplifier (SSPA).

show abstract

Spray cooling at low system pressure

Cited by 12 publications

References 5 publications

Research Progresses of Flash Evaporation in Aerospace Applications

Research Progresses of Flash Evaporation in Aerospace Applications

Generation and Evaporation of Microsprays

Chip-Level Spray Cooling of an LD-MOSFET RF Power Amplifier<tex>$^+$</tex>

Contact Info

Product

Resources

About

Spray cooling at low system pressure

Cited by 12 publications

References 5 publications

Research Progresses of Flash Evaporation in Aerospace Applications

Research Progresses of Flash Evaporation in Aerospace Applications

Generation and Evaporation of Microsprays

Chip-Level Spray Cooling of an LD-MOSFET RF Power Amplifier&lt;tex&gt;$^+$&lt;/tex&gt;

Contact Info

Product

Resources

About

Chip-Level Spray Cooling of an LD-MOSFET RF Power Amplifier<tex>$^+$</tex>