2011
DOI: 10.1016/j.tsf.2011.01.087
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Sputter deposited LiPON thin films from powder target as electrolyte for thin film battery applications

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Cited by 85 publications
(78 citation statements)
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“…It has two peaks representing the 2p 1/2 and 2p 3/2 (0.8 eV lower than 2p 1/2 [17]) contributions to the phosphorus bonding in PN x O 4-x tetrahedron. Studies on XPS of LiPON showed a reduction in P2p binding energy of Li 3 PO 4 when P-O bonds are gradually replaced by P-N bonds, which change the charge distribution around phosphorus in thin films [18,19]. In Fig.…”
Section: Electrochemicalmentioning
confidence: 99%
“…It has two peaks representing the 2p 1/2 and 2p 3/2 (0.8 eV lower than 2p 1/2 [17]) contributions to the phosphorus bonding in PN x O 4-x tetrahedron. Studies on XPS of LiPON showed a reduction in P2p binding energy of Li 3 PO 4 when P-O bonds are gradually replaced by P-N bonds, which change the charge distribution around phosphorus in thin films [18,19]. In Fig.…”
Section: Electrochemicalmentioning
confidence: 99%
“…The powder compact target was presputtered for an hour to remove any hydrocarbons present. Based on our earlier studies [12], the deposition time of 40 minutes, rf power density of 3 Wcm − 2 , and N 2 flow of 30 sccm were optimized for best ionic conductivity in the deposited films. The substrate temperature was not controlled during deposition, but rises to 110°C towards the end of deposition due to plasma heating.…”
Section: Contents Lists Available At Sciencedirectmentioning
confidence: 99%
“…Our efforts for depositing RF sputtered LiPON thin films from an Li 3 PO 4 powder target in nitrogen plasma with high deposition rate (typically 30 nm/min) have been successfully accomplished with a good ionic conductivity of 1.1 × 10 − 6 S cm − 1 [12] for the deposited films. During this study, it was noted that there are some typical conditions and requirements for deposition and handling of LiPON thin films or devices based on them.…”
Section: Introductionmentioning
confidence: 99%
“…However, hot pressed or sintered ceramic targets may have a tendency to crack due to the localized thermal shock induced by the collisions of the energetic particles 180/ [684] G. J. Lee et al in high-density plasma [12][13][14]. In addition, a change in the chemical composition on the target surface during the entire fabrication process can cause the non-uniformity of TTFT performances.…”
Section: Introductionmentioning
confidence: 99%