Sputtered alloy coatings by codeposition: Effects of bias voltage

Mawella, K. J. A.; Sheward, J. A.

doi:10.1016/s0040-6090(05)80008-2

Cited by 18 publications

(3 citation statements)

References 8 publications

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“…Concerning the deposition rate variation, our result is in good agreement with several studies. [21][22][23][24][25][26] For instance, [26] in the case of Cr-Mo-Si-N coatings prepared on Si wafers by a hybrid system combining arc ion plating and magnetron sputtering, the deposition rate decreased from 2.2 to 1.6 μm/h when the negative bias voltage changed from 0 to 400 V. Authors explained this variation by a resputtering effect of a part of the coating. Whereas, in another study, [27] it has been observed that the deposition rate of TiN films deposited by RF reactive sputtering decreased from 0.17 to 0.15 nm/s when the negative bias voltage changed from 0 to 150 V and then remained almost constant for higher voltage values.…”

Section: Measurement Of Critical Loadmentioning

confidence: 99%

Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

Ouis

Cailler

2013

Journal of Adhesion Science and Technology

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The adhesion strength of copper thin films on E24 carbon steel substrates was studied using the scratch test via the critical load. Coatings were deposited by a DC magnetron sputtering system. All substrates were mechanically polished; some of them were directly coated and others were ion-etched by argon ions prior to deposition process. The effects of substrate negative bias voltage during the film growth were investigated. Experimental results showed that the critical load depended on the bias voltage and that the higher bias voltage, the better adhesion. It was also observed that the deposition rate of deposited films gradually decreased with the increase of the substrate bias voltage. Furthermore, the working pressure during the substrate ion bombardment etching greatly affected the critical load. Scanning electron microscopy was used to observe the scratch tracks to accurately evaluate the critical load. Substrate surface profiles obtained by a mechanical profilometer showed that the critical load increased with the increase of the surface roughness. The analysis by Auger electron spectroscopy revealed that the interface, in case of an unbiased substrate, was relatively narrow and abrupt. However, in case of a bias voltage application, the interface was wider and more diffuse. These results suggest that the mechanisms involved in critical load enhancement are due firstly to the substrate surface roughness and the substrate temperature generated by the ion bombardment, secondly to the physical mixing in the interfacial domain and the densification of the deposited material created by the bias voltage.

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Section: Measurement Of Critical Loadmentioning

confidence: 99%

Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

Ouis

Cailler

2013

Journal of Adhesion Science and Technology

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“…The outstanding corrosion resistance of niobium is commonly considered to stem from a stable niobium oxide passive film developed on the surface. Therefore, its corrosion behavior mainly depends on the nature and stability of the oxide film [16,17]. Studies have shown that the passive film developed on niobium surface is an n-type semiconductor [18,19].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical Properties of Niobium Coating for Biomedical Application

Shi

Zhang

et al. 2019

Coatings

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The preparation of the Nb coating was performed on the bare Ti–6Al–4V alloy using the double glow discharge plasma technique. It was characterized that the Nb coating exhibited a face centered cubic (fcc) crystal structure and a pronounced (200) preferred orientation. The SEM micrograph of the cross section for the coating displayed dense microstructure with a thickness of approximately 18 µm. The critical load (Lc) of the coating was determined to be about 83.5 N by the scratch tests. The electrochemical corrosion resistance of the coating was examined in Ringer’s solution at 37 °C by a series of electrochemical techniques, including open-circuit potential (OCP), potentiodynamic polarization, electrochemical impedance spectroscopy (EIS), and a Mott–Schottky analysis. As the result of the potentiodynamic polarization, the Nb coating possessed a more positive corrosion potential and lower corrosion current density than the Ti–6Al–4V substrate. EIS fitting date showed that the Nb coating always possessed a higher value of impedance and lower effective capacitance than those of the substrate during the five days of immersion testing. The main component of the passive film developed on the Nb coating was Nb2O5, confirmed by an X-ray photoelectron spectroscopy (XPS) analysis. A Mott–Schottky analysis demonstrated typical n-type semiconductor characteristics of the Nb coating, and both the donor density and flat band potential of the coating were lower than those of the substrate at all the given formation potential. These investigations demonstrate that the Nb coating can significantly improve the corrosion protection of uncoated Ti–6Al–4V and is thus a promising coating for the surface protection of bioimplants.

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“…This is because their disordered atomic arrangements contribute to various properties different from those of regular crystalline metals [1,2]. Besides all the well-known processes such as rapid quenching and mechanical alloying, co-deposition of two or more elements is also known to be effective in producing alloys with near-amorphous structure [3,4,5]. More interestingly, the structure of these films is expected to be dense and boundary-free, leading to the improved performance of thin film that is otherwise impaired by its porous columnar grains.…”

Section: Introductionmentioning

confidence: 99%

Near-Amorphous Alloy Thin Films by Co-Sputtering Deposition

Hsieh

Li²,

Wang

et al. 2005

JMNM

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Four alloy thin films were deposited on Si(100) by co-sputtering of various metals to investigate the formation of near-amorphous structure which may lead to featureless surface morphology and boundary-free structure. These thin films, Nb-Cr, Ta-Cr, Ti-Nb, and Zr-Cr, were examined using XRD SEM, and TEM. It is found that the forming ranges of near-amorphous thin films by co-sputtering are related to the difference in atomic size of the paired metals as well as their heat of mixing. Accordingly, Zr-Cr has the widest concentration range to form the near-amorphous structure. The addition of nitrogen during deposition can further enhance amorphization and reduce the surface roughness, until nitride phases are formed.

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Sputtered alloy coatings by codeposition: Effects of bias voltage

Cited by 18 publications

References 8 publications

Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

Effects of substrate bias voltage on adhesion of DC magnetron-sputtered copper films on E24 carbon steel: investigations by Auger electron spectroscopy

Electrochemical Properties of Niobium Coating for Biomedical Application

Near-Amorphous Alloy Thin Films by Co-Sputtering Deposition

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