Static and dynamic behaviour of ECAPed copper alloy

Abstract

The equal channel angular processing (ECAP) is a severe plastic deformation technique which can produce ultrafine-grained (UFG) alloy. This paper investigate the static and dynamic behaviour of ECAPed OFHC-Cu to evaluate possibility of its application to defence industries. Tensile tests were carried out at two different strain rate (10-3/s, 1/s) using digital image correlation (DIC) technique. High strain rate experiments were conducted using the split Hopkinson pressure bar (SHPB). The results were compared with forged OFHC-Cu and additional heat treated OFHC-Cu after processed by ECAP. Flow stress and strain sensitivity of ECAPed OFHC-Copper were increased compare to forged OFHC-Copper. After ECAPed copper heat treatment, the yield strength decreased with increasing of the average grain size. And numerical simulation of ECAPed copper shaped charge was performed using Autodyn hydrodynamic code.

Dynamic Tensile Extrusion Behavior of Fine-Grained Copper Fabricated by Powder Injection Molding

“…It is clearly observable that recrystallized grains, indicated by red in Figure 1c,f, are numerous in both the FGM and FGH specimens. The recrystallized FG microstructures shown in Figure 3 in the present research are quite different from those of the UFG-B and FG-150 fabricated by the ECAP, shown in Figure 1, from the previous study [9], which showed UFG and FG microstructures with a The recrystallized FG microstructures shown in Figure 3 in the present research are quite different from those of the UFG-B and FG-150 fabricated by the ECAP, shown in Figure 1, from the previous study [9], which showed UFG and FG microstructures with a high density of dislocation-related substructures developed due to severe plastic deformation [9,13]. To compare the density of the substructures clearly, the misorientationangle distributions from the EBSD results for the UFG-B, FG-150, FGM, and FGH Cu are presented in Figure 4.…”

“…This implies that the deformation substructures and grain boundary character distribution, which are quite different for the two FG Cu groups fabricated by the PIM and ECAP, respectively, are factors that have major effects on the DTE behavior. high density of dislocation-related substructures developed due to severe plastic deformation [9,13]. To compare the density of the substructures clearly, the misorientation-angle distributions from the EBSD results for the UFG-B, FG-150, FGM, and FGH Cu are presented in Figure 4.…”