The equal channel angular processing (ECAP) is a severe plastic deformation technique which can produce ultrafine-grained (UFG) alloy. This paper investigate the static and dynamic behaviour of ECAPed OFHC-Cu to evaluate possibility of its application to defence industries. Tensile tests were carried out at two different strain rate (10-3/s, 1/s) using digital image correlation (DIC) technique. High strain rate experiments were conducted using the split Hopkinson pressure bar (SHPB). The results were compared with forged OFHC-Cu and additional heat treated OFHC-Cu after processed by ECAP. Flow stress and strain sensitivity of ECAPed OFHC-Copper were increased compare to forged OFHC-Copper. After ECAPed copper heat treatment, the yield strength decreased with increasing of the average grain size. And numerical simulation of ECAPed copper shaped charge was performed using Autodyn hydrodynamic code.
The dynamic tensile extrusion (DTE) behavior and microstructural evolution of fine-grained (FG, ~1 μm < d < ~10 μm) Cu fabricated by powder injection molding (PIM) were investigated. The FGM Cu was fabricated by PIM with commercial micro-sized Cu powder sintering at 850 °C for 2 h, while the FGH Cu was developed by the hot isostatic pressing (HIP) of the FGM at 780 °C for 2 h under a pressure of 1000 bar. In order to compare the DTE behavior of the FG Cu manufactured using different methods, the ultrafine-grained-B (UFG, d < ~1 μm) Cu was developed by performing 16 passes of equal-channel angular pressing with route Bc, and the FG-150 Cu was fabricated by annealing the UFG-B Cu bar at 150 °C for 1 h. The DTE tests were performed with identical flyer velocities using an all-vacuum gas gun. The fragments and remnants were carefully recovered after the DTE tests and examined by electron backscattered diffraction measurement and a micro-Vickers hardness test. A strong dual <001> + <111> texture was developed during the DTE for both FGM and FGH Cu. In contrast to the outcome of the UFG-B and FG-150, little evidence of dynamic recrystallization taking place during the DTE in the FGM and FGH was found during analysis of the grain morphology and grain orientation spread. Premature failure based on void coalescence was induced at the vertex region of the FGM fragments due to pre-existing pores. The HIP treatment on the FGM Cu increased the relative density by reducing the pre-existing pores and, as a result, increased the DTE ductility of the FGH Cu.
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