2016
DOI: 10.1016/j.microrel.2016.10.014
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Statistical distributions of row-hammering induced failures in DDR3 components

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Cited by 26 publications
(34 citation statements)
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“…Since the RowHammer failure is mainly caused by the traps in the interface (according to the authors' hypotheses), the authors show that this technique can help to improve DRAM reliability against crosstalk and thus alleviate RowHammer attacks. [192] and [193] experimentally test DDR3 devices for RowHammer susceptibility, show statistical distributions of RowHammer failures across many devices, and present evidence that the root cause of the RowHammer phenomenon is charge recombination of the victim cell with electrons from the current channels between neighboring cells and their corresponding bitlines.…”
Section: Circuit-level Studies Of Rowhammermentioning
confidence: 92%
“…Since the RowHammer failure is mainly caused by the traps in the interface (according to the authors' hypotheses), the authors show that this technique can help to improve DRAM reliability against crosstalk and thus alleviate RowHammer attacks. [192] and [193] experimentally test DDR3 devices for RowHammer susceptibility, show statistical distributions of RowHammer failures across many devices, and present evidence that the root cause of the RowHammer phenomenon is charge recombination of the victim cell with electrons from the current channels between neighboring cells and their corresponding bitlines.…”
Section: Circuit-level Studies Of Rowhammermentioning
confidence: 92%
“…The simplifying assumption used in (5) and (6) as was used by Sakurai [14] is that the source resistance of the circuit driving the wordlines is negligible compared to the line resistance. This seems reasonable in the case of a DRAM wordline where the tungsten gate will probably result in tens of ohms per cell.…”
Section: Capacitive Crosstalkmentioning
confidence: 99%
“…Scienti c Error-Characterization Studies. Scienti c errorcharacterization studies explore physical DRAM error mechanisms (e.g., data retention [42, 43, 46, 74, 75, 78-81, 109, 139, 157, 172, 173], reduced access-latency [16, 17, 20, 37, 83-85, 102, 104], circuit disturbance [35,79,81,86,90,135,136]) by deliberately exacerbating the error mechanism and analyzing the resulting errors' statistical properties (e.g., frequency, spatial distribution). ese studies help build error models [20,31,43,83,94,104,157,178], leading to new DRAM designs and operating points that improve upon the state-of-the-art.…”
Section: Secrecy Concerning On-die Eccmentioning
confidence: 99%
“…Deliberately inducing DRAM errors (e.g., by violating default timing parameters) reveals detailed information about a DRAM chip's internal design through the resulting errors' statistical characteristics. Prior works use custom memory testing platforms (e.g., FPGA-based [46]) and commodity CPUs [6,57] (e.g., by changing CPU con guration registers via the BIOS [56]) to study a variety of DRAM error mechanisms, including data-retention [26,90,95,109,110,138,139], circuit timing violations [17, 83-85, 102, 104], and RowHammer [86,90,125,126,135,136]. Our work focuses on dataretention errors because they exhibit well-studied properties that are helpful for our purposes: 1.…”
Section: Studying Dram Errorsmentioning
confidence: 99%
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