Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Cheng, Hsien‐Chie; Yu, Ching-Feng; Chen, Wen‐Hwa

doi:10.1007/s10853-011-6144-x

Cited by 52 publications

(36 citation statements)

References 32 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Moreover, the mechanical responses for different structures vary from one another. the structure with (001) surface Cu has a yield stress of 9573 MPa, which is much larger than the results obtained from other structures (range of 5300-6400 MPa) and is slightly lower than the tensile result for single Cu3Sn from Hsien-Chie Cheng et al [15] (σ22 with the strain rate of 0.362% ps -1 in their simulation). …”

Section: Mechanical Behaviour Of Cu-cu3sn With Different Orientation contrasting

confidence: 63%

“…The propagation of such interface cracks may be accompanied by dissipative mechanisms, such as dislocation motion and structural rearrangement, which play a powerful role in the deformation process. Addressing the failure mechanism of interface structure between different grains, Pradeep Gupta et al [14] reported the Al-Cu50Zr50 metallic glass interfacial behaviour under mode-I and mode-II loading conditions based on MD simulation and analysed the dislocation evolution during these progresses; Hsien-Chie Cheng et al [15] and Karoon Mackenchery et al [16] studied the mechanical character of single Cu3Sn and Cu under tensile uniaxial tension separately. To the authors' knowledge, prior to this study, no MD simulation study reported the reliability of the Cu-Cu3Sn interface structure.…”

Section: Introductionmentioning

confidence: 99%

“…To better describe the interactions between the Cu and Sn atoms, the modified embedded atom method (MEAM) interatomic potential was used. The MEAM interatomic potential has been fully discussed in references [21,22], and it has provided good results in simulating the mechanical properties [15,23], defect formation [24][25][26] and diffusivity [27,28] of both solid and liquid materials; thus, it will not be introduced here again.…”

mentioning

confidence: 99%

“…The MEAM parameters for the pure elements of Cu and Sn were taken from the database in LAMMPS, the L12 structure is here considered as the reference structure for Cu3Sn, and the MEAM interatomic potential of Cu-Sn used in LAMMPS can be found in [15,29], as shown in table 1. In our system, the angular screening was implemented using the method described in [22].…”

mentioning

confidence: 99%

See 3 more Smart Citations

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Liang¹,

Zhang²,

Xu³

et al. 2018

Preprint

View full text Add to dashboard Cite

Abstract:In this paper, the nanoscale dissipative mechanisms of a Cu pad in a Ball Grid Array (BGA) packaging structure during isothermal ageing and uniaxial tension were investigated by the molecular dynamics (MD) method and experiments. From the result of the isothermal ageing test, a nonuniform consumption of Cu and large amount of Kirkendall voids were observed at the interface of Cu and Cu3Sn. To study the effect of pressure and orientation on this phenomenon, MD simulations were conducted on four types of Cu-Cu3Sn interface structures with different orientations of Cu. By comparing the diffusion coefficients of atoms in those cases, it was found that the tensile stress would inhibit the diffusion of atoms, whereas compressive stress would accelerate it, and this would be more significant under a larger magnitude of stress and temperature. Note that, in the model with the (101) surface Cu at the interface, both Cu and Cu3Sn have a higher diffusion coefficient compared with the model with (001) surface Cu. Thus, the orientation of Cu will also contribute to the uniform consumption of the pad. Uniaxial tension simulation combined with DXA and CSP analyses on those models also shows the model with (001) surface Cu has a greater mechanical reliability in our simulations and related experiments.

show abstract

Section: Mechanical Behaviour Of Cu-cu3sn With Different Orientation contrasting

confidence: 63%

Section: Introductionmentioning

confidence: 99%

mentioning

confidence: 99%

mentioning

confidence: 99%

See 2 more Smart Citations

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Liang¹,

Zhang²,

Xu³

et al. 2018

Preprint

View full text Add to dashboard Cite

show abstract

“…13, the ultimate shear strength was calculated from the maximum loading force divided by the actual fractured area, which is approximately 176MPa. This is much less than the calculated strength of single-crystal Cu 3 Sn [31], but it is two times higher than the value from Lee's work [32]. This drastic increase in strength can be attributed by the existence of finer grains of the Cu 3 Sn layer, through the mechanism known as fine-grain strengthening [33].…”

mentioning

confidence: 61%

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Chen

et al. 2015

Intermetallics

View full text Add to dashboard Cite

Citation: MO, L. et al., 2015 Meanwhile, some equiaxial ultra-fine grains accompanied with the Kirkendall voids, were found only in adjacent to the electroplated copper. In addition, a specific type of micropillar with the size ~5μm×5μm×12μm fabricated by focus ion beam (FIB) was used to carry out the mechanical testing by Nano-indentation, which confirmed that this type of joint is mechanically robust, regardless of its porous Cu 3 Sn IMC interconnection.

show abstract

Regulating Li electrodeposition by constructing Cu–Sn nanotube thin layer for reliable and robust anode‐free all‐solid‐state batteries

Kim,

Lee,

Kim

et al. 2024

Carbon Energy

View full text Add to dashboard Cite

Anode‐free all‐solid‐state batteries (AF‐ASSBs) have received significant attention as a next‐generation battery system due to their high energy density and safety. However, this system still faces challenges, such as poor Coulombic efficiency and short‐circuiting caused by Li dendrite growth. In this study, the AF‐ASSBs are demonstrated with reliable and robust electrochemical properties by employing Cu–Sn nanotube (NT) thin layer (~1 µm) on the Cu current collector for regulating Li electrodeposition. LixSn phases with high Li‐ion diffusivity in the lithiated Cu–Sn NT layer enable facile Li diffusion along with its one‐dimensional hollow geometry. The unique structure, in which Li electrodeposition takes place between the Cu–Sn NT layer and the current collector by the Coble creep mechanism, improves cell durability by preventing solid electrolyte (SE) decomposition and Li dendrite growth. Furthermore, the large surface area of the Cu–Sn NT layer ensures close contact with the SE layer, leading to a reduced lithiation overpotential compared to that of a flat Cu–Sn layer. The Cu–Sn NT layer also maintains its structural integrity owing to its high mechanical properties and porous nature, which could further alleviate the mechanical stress. The LiNi0.8Co0.1Mn0.1O2 (NCM)|SE|Cu–Sn NT@Cu cell with a practical capacity of 2.9 mAh cm−2 exhibits 83.8% cycle retention after 150 cycles and an average Coulombic efficiency of 99.85% at room temperature. It also demonstrates a critical current density 4.5 times higher compared to the NCM|SE|Cu cell.

show abstract

Strain- and strain-rate-dependent mechanical properties and behaviors of Cu3Sn compound using molecular dynamics simulation

Cited by 52 publications

References 32 publications

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

A Molecular Dynamics Investigation of the Effect of Pressure and Orientation on the Cu Consumption in Cu-Cu3Sn Interface under Isothermal Ageing and Its Dissipative Mechanisms during Traction

Microstructural and mechanical analysis on Cu–Sn intermetallic micro-joints under isothermal condition

Regulating Li electrodeposition by constructing Cu–Sn nanotube thin layer for reliable and robust anode‐free all‐solid‐state batteries

Contact Info

Product

Resources

About