2005
DOI: 10.1063/1.1891282
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Strain compensation in boron-indium coimplanted laser thermal processed silicon

Abstract: Strain in B-implanted laser thermal processed ͑LTP͒ silicon is reduced by coimplantation of In. Strain in the codoped layer is calculated using lattice constants measured by high-resolution x-ray diffraction. Compensation of the strain with increasing In dose corresponds to suppression of the carrier deactivation during post-LTP annealing.

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Cited by 8 publications
(1 citation statement)
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“…Ti was implanted at 30 keV, with three different doses: 10 15 , 5×10 15 and 10 16 cm −2 . Then, the implanted Si samples were annealed by means of the PLM method [18] to activate the Ti impurities. The PLM annealing process was performed by J P Sercel Associates Inc. (New Hampshire, USA).…”
Section: Methodsmentioning
confidence: 99%
“…Ti was implanted at 30 keV, with three different doses: 10 15 , 5×10 15 and 10 16 cm −2 . Then, the implanted Si samples were annealed by means of the PLM method [18] to activate the Ti impurities. The PLM annealing process was performed by J P Sercel Associates Inc. (New Hampshire, USA).…”
Section: Methodsmentioning
confidence: 99%