Abstract:Pre-strained fin-patterned Si/SiGe multilayer structures for sub-7 nm stacked gate-all-around Si-technology transistors that have been grown onto bulk-Si, virtually relaxed SiGe, strained Silicon-On-Insulator, and compressive SiGe-On-Insulator were investigated. From strain maps with a nanometer spatial resolution obtained by transmission electron microscopy, we developed 3D quantitative numerical models describing the mechanics of the structures. While elastic interactions describe every other system reported… Show more
“…Fig. 3 shows the finite element mechanical simulation results and good matching with PED results was obtained [2].The investigation of strain distribution in the nanosheet at various device fabrication steps will be discussed. For example, Fig.…”
“…Fig. 3 shows the finite element mechanical simulation results and good matching with PED results was obtained [2].The investigation of strain distribution in the nanosheet at various device fabrication steps will be discussed. For example, Fig.…”
“…There is no other testing technique that can do this. Therefore, HRXRD is an important method for the characterization of 10 nm and above nodes [ 433 , 434 , 435 , 436 , 437 , 438 , 439 , 440 , 441 , 442 ].…”
Section: Advanced Characterizations For Ultra-miniaturized Cmosmentioning
The international technology roadmap of semiconductors (ITRS) is approaching the historical end point and we observe that the semiconductor industry is driving complementary metal oxide semiconductor (CMOS) further towards unknown zones. Today’s transistors with 3D structure and integrated advanced strain engineering differ radically from the original planar 2D ones due to the scaling down of the gate and source/drain regions according to Moore’s law. This article presents a review of new architectures, simulation methods, and process technology for nano-scale transistors on the approach to the end of ITRS technology. The discussions cover innovative methods, challenges and difficulties in device processing, as well as new metrology techniques that may appear in the near future.
“…HRXRD is emphasized as an important tool to characterize 10-nm node and beyond. It has been demonstrated that in-line HRXRD can monitor the pre-fin and post-fin etching processes in FinFET [248]. IMEC demonstrated an in-line HRXRD set-up for analyzing composition and strain for nano-scale level devices.…”
Section: Advanced Characterization For Ultra-miniaturized Cmosmentioning
When the international technology roadmap of semiconductors (ITRS) started almost five decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) continuously miniaturized. The transistor structure has radically changed from its original planar 2D architecture to today’s 3D Fin field-effect transistors (FinFETs) along with new designs for gate and source/drain regions and applying strain engineering. This article presents how the MOSFET structure and process have been changed (or modified) to follow the More Moore strategy. A focus has been on methodologies, challenges, and difficulties when ITRS approaches the end. The discussions extend to new channel materials beyond the Moore era.
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