2018
DOI: 10.1063/1.5010997
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Strain, stress, and mechanical relaxation in fin-patterned Si/SiGe multilayers for sub-7 nm nanosheet gate-all-around device technology

Abstract: Pre-strained fin-patterned Si/SiGe multilayer structures for sub-7 nm stacked gate-all-around Si-technology transistors that have been grown onto bulk-Si, virtually relaxed SiGe, strained Silicon-On-Insulator, and compressive SiGe-On-Insulator were investigated. From strain maps with a nanometer spatial resolution obtained by transmission electron microscopy, we developed 3D quantitative numerical models describing the mechanics of the structures. While elastic interactions describe every other system reported… Show more

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Cited by 31 publications
(34 citation statements)
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“…Fig. 3 shows the finite element mechanical simulation results and good matching with PED results was obtained [2].The investigation of strain distribution in the nanosheet at various device fabrication steps will be discussed. For example, Fig.…”
supporting
confidence: 53%
“…Fig. 3 shows the finite element mechanical simulation results and good matching with PED results was obtained [2].The investigation of strain distribution in the nanosheet at various device fabrication steps will be discussed. For example, Fig.…”
supporting
confidence: 53%
“…There is no other testing technique that can do this. Therefore, HRXRD is an important method for the characterization of 10 nm and above nodes [ 433 , 434 , 435 , 436 , 437 , 438 , 439 , 440 , 441 , 442 ].…”
Section: Advanced Characterizations For Ultra-miniaturized Cmosmentioning
confidence: 99%
“…HRXRD is emphasized as an important tool to characterize 10-nm node and beyond. It has been demonstrated that in-line HRXRD can monitor the pre-fin and post-fin etching processes in FinFET [248]. IMEC demonstrated an in-line HRXRD set-up for analyzing composition and strain for nano-scale level devices.…”
Section: Advanced Characterization For Ultra-miniaturized Cmosmentioning
confidence: 99%