Strategy for Improvement of Non-flammability in Functional Polyimides

Ishii, Junichi; Yokotsuka, Hideyuki; Saito, Takayuki; Hasegawa, Masatoshi

doi:10.2494/photopolymer.24.287

Cited by 8 publications

(6 citation statements)

References 9 publications

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“…PIs are one class of high-performance polymers containing imide rings ( Figure 1 ). They exhibit superior performance driven by their rigid aromatic structures and imide rings [ 45 , 46 , 47 , 48 ]. Since aromatic PI was first prepared, PIs have developed into various aliphatic, aromatic, and aliphatic–aromatic structures and dominant engineering plastic for high-temperature resistance applications [ 49 , 50 , 51 ].…”

Section: Pi Basic Informationmentioning

confidence: 99%

Research Progress and Application of Polyimide-Based Nanocomposites

Liu

Wang

et al. 2023

Nanomaterials

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Polyimide (PI) is one of the most dominant engineering plastics with excellent thermal, mechanical, chemical stability and dielectric performance. Further improving the versatility of PIs is of great significance, broadening their application prospects. Thus, integrating functional nanofillers can finely tune the individual characteristic to a certain extent as required by the function. Integrating the two complementary benefits, PI-based composites strongly expand applications, such as aerospace, microelectronic devices, separation membranes, catalysis, and sensors. Here, from the perspective of system science, the recent studies of PI-based composites for molecular design, manufacturing process, combination methods, and the relevant applications are reviewed, more relevantly on the mechanism underlying the phenomena. Additionally, a systematic summary of the current challenges and further directions for PI nanocomposites is presented. Hence, the review will pave the way for future studies.

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Section: Pi Basic Informationmentioning

confidence: 99%

Research Progress and Application of Polyimide-Based Nanocomposites

Liu

Wang

et al. 2023

Nanomaterials

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“…It must be underlined that the outstanding solubility of the polyimides in low boiling point solvent can reduce the processing temperature of the polymer film. The excellent solubility of the polyimides may have the potential application prospects in many high-tech fields, such as coating materials for advanced microelectronics manufacturing, flexible organic solar cells, flexible printed circuit board (FPCP), and flexible displays [23,[29][30][31].…”

Section: Solubilitymentioning

confidence: 99%

Synthesis and characterization of novel highly soluble and optical transparent polyimides containing tert-butyl and morpholinyl moieties

et al. 2015

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A series of novel organo-soluble and optical transparent polyimides were synthesized via conventional one-step polycondensation from a novel diamine, 3,3′-diterbutyl-4,4′-diaminodiphenyl-4″-morpholinophenylmethane (TAMPM) and various commercial aromatic dianhydrides. The structures of monomer and polymers were confirmed by FT-IR and NMR. The solubility, thermal stability, optical transparency, dielectric and hydrophobic properties of polyimides were investigated. The results showed polymers presented excellent solubility in common organic solvents, such as N,Ndimethylformamide (DMF), N,N-dimethyl acetamide (DMAc), dimethyl sulfoxide (DMSO), N-methyl-2-pyrrolidone (NMP), chloroform (CHCl 3 ), tetrahydrofuran (THF) and dichloromethane (CH 2 Cl 2 ). The polymers exhibited prominent thermal stability and high optical transparency with the glass transition temperature (T g ) in the range of 311-355°C, and the cutoff wavelengths in the range of 287-344 nm. Furthermore, all of the polymers also presented low dielectric constants in the range of 2.85-3.16 at 1 MHz, and outstanding hydrophobic properties with the contact angle in the rang of 85.1-94.2 o .

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“…[1][2][3] One of the most important applications of PIs is dielectric substrates for flexible printed circuit (FPC) boards. 4,5 For next-generation FPCs, PI films are expected to offer enhanced T g , reduced coefficients of thermal expansion (CTE), and lower D k and dissipation factor (D f ) at high frequencies (≥10 GHz). Traditional low-CTE PI films, such as Upilex S from Ube, Kapton from Du Pont, and Apical from Kaneka, exhibit relatively high D k and D f because of their high water/moisture uptake, 6,7 which cannot meet the stringent requirement in 5G communication applications.…”

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of poly(ester imide) copolymers from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 2,2′‐bis(trifluoromethyl)benzidine, and 4‐aminophenyl‐4′‐aminobenzoate

Zheng,

Gong,

Pang

et al. 2024

J of Applied Polymer Sci

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A series of poly(ester imide) (PEsI) copolymers were synthesized using 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (4,4′‐BPDA), 2,2′‐bis(trifluoromethyl)benzidine (TFMB), and 4‐aminophenyl‐4′‐aminobenzoate (APAB) as the monomers. Wide‐angle x‐ray diffraction results revealed that the average interchain distances of these polymers ranged from 4.6 to 5.7 Å, increasing with the increase of TFMB contents. PEsI‐0.3 and PEsI‐0.4 exhibited a glass transition temperature (Tg) of 445 and 455°C, respectively, while no distinctive Tg was observed for the PEsI copolymers when the APAB content was >50 mol%. The coefficients of thermal expansion (CTE) of these PEsI copolymers ranged from 3.8 to 24.2 ppm K−1, increasing with the increase of TFMB contents. The PEsI copolymers exhibited a modulus of 5.7–7.8 GPa, a tensile strength of 282–332 MPa, and an elongation‐at‐break of 10.2%–23.3%. Furthermore, these copolymers exhibited a dielectric constant of 2.53–2.76, and a low dissipation factor (Df) of 0.0026–0.0032 at 10 GHz in dry state. Because of their excellent combined properties, these PEsI copolymers are promising candidates as dielectric substrate materials for the applications in next generation flexible printed circuit boards operating at high frequencies.

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Strategy for Improvement of Non-flammability in Functional Polyimides

Cited by 8 publications

References 9 publications

Research Progress and Application of Polyimide-Based Nanocomposites

Research Progress and Application of Polyimide-Based Nanocomposites

Synthesis and characterization of novel highly soluble and optical transparent polyimides containing tert-butyl and morpholinyl moieties

Synthesis and properties of poly(ester imide) copolymers from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride, 2,2′‐bis(trifluoromethyl)benzidine, and 4‐aminophenyl‐4′‐aminobenzoate

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