2011
DOI: 10.1016/j.jmmm.2011.06.017
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Stress analysis, structure and magnetic properties of sputter deposited Ni–Mn–Ga ferromagnetic shape memory thin films

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Cited by 12 publications
(8 citation statements)
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“…In addition, thermal stress is generated through the heat treatment process. Previous research reports that the compressive or tensile stress acts according to the difference in the thermal expansion coefficient of the substrate and the thin film . In the case of the Corning Eagle XG glass, the thermal expansion coefficient is 3.7 × 10 −6 /°C, which is smaller than the thermal expansion coefficient of the ITO thin film (7.6 × 10 −6 /°C).…”
Section: Resultsmentioning
confidence: 99%
“…In addition, thermal stress is generated through the heat treatment process. Previous research reports that the compressive or tensile stress acts according to the difference in the thermal expansion coefficient of the substrate and the thin film . In the case of the Corning Eagle XG glass, the thermal expansion coefficient is 3.7 × 10 −6 /°C, which is smaller than the thermal expansion coefficient of the ITO thin film (7.6 × 10 −6 /°C).…”
Section: Resultsmentioning
confidence: 99%
“…50 Atom pinning in the lattice during film deposition at higher sputtering power causes compressive stress in the film, as reported in the literature. 37 The FWHM and intensity of the peaks differed for the annealed film compared with the as-deposited film. These results reveal that the internal stress of the film is released after annealing.…”
Section: Structural Analysismentioning
confidence: 98%
“…37,50,51 The position of the (220) fundamental reflection peak (Figs. 1 and 2) shifted towards higher 2h value, indicating a decrease in interatomic spacing.…”
Section: Structural Analysismentioning
confidence: 99%
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“…The character of the ρ (T) dependence is caused by the scattering of charge carriers on lattice defects (impurity atoms or atomic disorder), phonons (lattice vibrations) and by spin disorder. The phonon contribution increases with increasing temperature and is proportional to T at high temperature [34][35][36][37][38]. In magnetic materials, there is a large contribution to the resistivity due to spin disorder.…”
Section: Intermartensitic Transformationmentioning
confidence: 99%