Stress and Temperature Simulation Using Copper-Diamond Composite Slug

Operating Temperature Analysis of LED with Cylindrical Cu Slug

“…When the input powet is supplied to the GaN chip, forward bias occurs at the p-n junction of the LED. During forward bias, the electrons from the p-region and holes from the nregion will advance towards the p-n junction [1][2][3][4][5][6][7][8]. During this process, a recombination process with accordance to the respective band gap energy takes place with results in photon emission.…”

“…During this process, a recombination process with accordance to the respective band gap energy takes place with results in photon emission. However, only 20 percent of the input power is emitted as photons and the remaining 80 percent of the input power is converted into heat which is simultaneous transfered into the LED package and out through the aluminum heat sink [6][7][8]. Thus with an increase input power, the photon emission and heat generates simultaneously augments with results in rising of junction temperature and Von Mises stress of the LED chip.…”

“…The simulation was executed using Ansys version 11 [6]. 3D model resembling a single chip LED with Cu cylindrical heat slug for the analysis.…”

Effects of Heat Slug Shapes on the Heat Dissipation of High Power LED

“…In this work, two 3D finite element model of a single chip LED package mounted on heat sink with varied heat slug shapes were constructed using Ansys version 11 [7,8,9]. Simulation condition and enviroment were set under natural convection condition at ambient temperature of 25 °C.The analysis was carried out with two types of aluminum based heat slug shapes, rectangular and cylindrical.…”

“…The junction temperature and von Mises stress of the LED chip with varied heat slug shapes were then examined thorugh the simulation software. Moreover, the thermal resistance of the LED chip with varied heat slug shapes were calculated using Equation 1 which is defined as [7,8,9]:…”