2011
DOI: 10.1016/j.actamat.2010.09.001
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Stress development during reaction of metallic nanospheres with gas

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Cited by 16 publications
(8 citation statements)
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“…The diffusion data of Peterson and Wiley in contrast, acquired from bulk measurements on large‐grained polycrystals of Cu 2 O at 700 °C ≤ T ≤ 1153 °C and oxygen partial pressures of 106pO28 × 102 atm, can be extrapolated to DCuinCu2O=1.4 × 1018 cm 2 s −1 at atmospheric pressures and T = 100 °C conditions. The faster diffusion observed here may result from diffusion along grain boundaries or through voids in the polycrystalline Cu 2 O shell, be facilitated by hydrostatic tensile stresses in the Cu core, or be enhanced by electric fields generated by adsorbed species on the nanoparticle surface …”
Section: Resultsmentioning
confidence: 91%
See 1 more Smart Citation
“…The diffusion data of Peterson and Wiley in contrast, acquired from bulk measurements on large‐grained polycrystals of Cu 2 O at 700 °C ≤ T ≤ 1153 °C and oxygen partial pressures of 106pO28 × 102 atm, can be extrapolated to DCuinCu2O=1.4 × 1018 cm 2 s −1 at atmospheric pressures and T = 100 °C conditions. The faster diffusion observed here may result from diffusion along grain boundaries or through voids in the polycrystalline Cu 2 O shell, be facilitated by hydrostatic tensile stresses in the Cu core, or be enhanced by electric fields generated by adsorbed species on the nanoparticle surface …”
Section: Resultsmentioning
confidence: 91%
“…[ 28 ] The measured activation energy for diffusion at these relatively low temperatures is signifi cantly reduced, however, from those observed in high temperature oxidation ( 120~180 a E = kJ mol −1 for 550 °C ≤ T ≤ 1050 °C) due to the dominant diffusion mode being along the grain boundaries that form in the growing Cu 2 O shell. [ 28 ] In addition, the diffusion coeffi cient in Cu nanocrystals at 100 °C may be extrapolated from literature data taken at T ≥ 600 °C to be approximately 7.5 10 [ 43 ] in contrast, acquired from bulk measurements on large-grained polycrystals of Cu 2 O at 700 °C ≤ T ≤ 1153 °C and oxygen partial pressures of 10 8 10 [ 44 ] be facilitated by hydrostatic tensile stresses in the Cu core, [ 45 ] or be enhanced by electric fi elds generated by adsorbed species on the nanoparticle surface. [ 3 ]…”
Section: Diffusion Coeffi Cient and A Cuincu2mentioning
confidence: 99%
“…Although the details of the nucleation and growth of the void(s) can be complicated due to different additional effects (stress development [4,10,14], non-steady state vacancy distribution [12], etc.) it is generally accepted that the overall growth of the hole is controlled by D A and t g ∼R o 2 /D A was obtained for the time to complete the shell formation [4,11] (R o is the initial particle radius).…”
Section: Introductionmentioning
confidence: 99%
“…The conventional interpretation has assumed that the void size is only dependent on the ratio of the metal and oxygen diffusivities in the binary phase [6,28]. These prior interpretations have assumed that D MM is much larger than D MX and, in most cases, have not justified this assumption.…”
Section: Nanocrystal Oxidation With Surface Energy Considerationsmentioning
confidence: 98%