Stress-Minimized Laser Soldering of h-pattern Multicrystalline Silicon Solar Cells

Britten, Simon W.; Olowinsky, Alexander; Gillner, Arnold

doi:10.1016/j.phpro.2013.03.064

Cited by 9 publications

(3 citation statements)

References 4 publications

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“…The transfer of results regarding stress-minimized scanning strategies for conventional busbar solar cells suggests a scanning direction from the center to the outside of the solar cell. [5] The copper foil is fixated after the processing of the first two contact points, which limits the degree of freedom of the composite foil regarding distortion when further contact points are processed. The scanning sequence of the contour laser soldering strategy, where the energy deposition is realized in a single transit of the laser beam, is depicted in Figure 10.…”

Section: Contour Laser Solderingmentioning

confidence: 99%

Quasi-simultaneous laser soldering for the interconnection of back-contact solar cells with composite foils

et al. 2014

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In this contribution we evaluate laser scanning approaches for the interconnection of the 31 electrical contacts of a MWT back-contact solar cell. The selective energy deposition with a laser system allows the minimization of thermomechanical stress in the wafer, but requires adapted scanning strategies to prevent damages in the solar cell top layer. The laser scanning process of the MWT solar cell is conducted in combination with a composite foil as an interconnector and a pre-dispensed solder paste. This approach is evaluated regarding the joining quality of the interconnection as a function of the scanning strategy

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Section: Contour Laser Solderingmentioning

confidence: 99%

Quasi-simultaneous laser soldering for the interconnection of back-contact solar cells with composite foils

et al. 2014

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“…In combination with a pyrometer, temperature-controlled soldering processes with high process stabilities lead to a consistent quality. Britten 7) showed that the laser soldering process lowered the diffusion of alloy components in the solder and enhanced the mechanical resistance of the interconnector by more than 50% compared to conventional infrared-soldered samples. On the other hand, there has been limited discussion within the field concerning the basic phenomena and performance of the laser soldering process.…”

Section: Introductionmentioning

confidence: 99%

Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

Nishikawa

Iwata

2015

Mater. Trans.

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Laser soldering has recently been introduced in industry because of its unique properties, which include localized and noncontact heating, a rapid rise and fall in temperature, and easy automation compared to reflow soldering. In this study, the effect of an annealing treatment on the impact strength of solder bumps heated using the laser process was investigated to improve the impact reliability of soldered joints. It was found that, in the as-soldered condition, a thin intermetallic compound (IMC) layer was formed at the interface of the solder bumps on a Cu pad when using the laser process with and without annealing. After aging at 150°C, the impact reliability of the solder bumps heated using the laser process with annealing was superior to that of the solder bumps heated using the laser process without annealing. This was because the IMC grains at the interface clearly grew to a large size. These were effective at preventing Cu atoms from diffusing to the interface of the joints soldered by the laser soldering process and may be the reason that the annealing treatment at 20 W for 5 s prevented the degradation of the maximum load of solder bumps when using the laser soldering at 40 W for 1 s.

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“…Recently, a laser reflow soldering process was introduced in industry for practical use because of its low cost and its unique properties such as localized and non-contact heating, rapid rise and fall in temperature, and ease of automation as compared to the reflow soldering process. However, there has been limited discussion on the basic phenomena of the laser reflow soldering process and the performance of the joints soldered by this process [1][2][3][4].…”

Section: Introductionmentioning

confidence: 99%

Microstructure of lead-free solder bumps using laser reflow soldering

Nishikawa¹,

Iwata²,

Kubota³

2014

IOP Conf. Ser.: Mater. Sci. Eng.

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Stress-Minimized Laser Soldering of h-pattern Multicrystalline Silicon Solar Cells

Cited by 9 publications

References 4 publications

Quasi-simultaneous laser soldering for the interconnection of back-contact solar cells with composite foils

Quasi-simultaneous laser soldering for the interconnection of back-contact solar cells with composite foils

Improvement of Joint Reliability of Sn-Ag-Cu Solder Bumps on Cu by a Laser Process

Microstructure of lead-free solder bumps using laser reflow soldering

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