Stress of electroless copper deposits on insulating and metal substrates

Brüning, Ralf; Sibley, Allison; Sharma, Tanu; Brown, Delilah A.; Demay, Thibault; Brüning, Frank; Bernhard, T.

doi:10.1016/j.tsf.2014.07.006

Cited by 15 publications

(14 citation statements)

References 12 publications

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“…The data obtained on two different types of metal substrates agree. Local stress data for each combination of plating bath and substrate are reproducible, but comparison with previous work shows that different stress distribution patterns emerge for each combination [10,11]. A common feature of Ni-free films on metal substrates is a small region of compressive stress at the interface, followed by a region of tensile stress.…”

Section: Local Stressmentioning

confidence: 69%

“…Accordingly, this process is not sufficiently resolved for numeric analysis in the stress data of most of the thinner films. When plating from a bath with constant post-plating stress onto ABS, we were able to observe this fast relaxation by itself [11]. We attribute this relaxation to the mechanical yielding of ABS near the ABS-Cu interface, releasing the strain energy build up by the tensile copper film.…”

Section: Time Evolution Of Average Film Stressmentioning

confidence: 82%

“…To grow copper only on one side of each leg, during activation opposite sides were covered with adhesive tape (3 M, type 851). Following a procedure described elsewhere, the spread of the test strips in the images is converted to curvature, allowing for the effect of gravity on the strip shape [11].…”

Section: Contents Lists Available At Sciencedirectmentioning

confidence: 99%

“…The magnitude of this jump, Δσ c , depends on the temperature change ΔT, the thermal expansion coefficients, the elastic constants and the thicknesses of film and substrate. Temperature-induced stress changes of the substrate/film composites, calculated according to the expression given by references [21,11], are shown by vertical bars in Fig. 4(a) and (b).…”

Section: Time Evolution Of Average Film Stressmentioning

confidence: 99%

“…Building upon a model for the stress evolution in pure metal films with high atomic mobility [6], we proposed segregation of the Ni in the grain boundaries (GBs) as the mechanism that suppresses Cu adatom diffusion into the GBs during deposition [7], thus avoiding the compressive regime that in Ni-free deposits can cause blisters during plating [8,9]. In-situ measurements of the average film stress during electroless deposition were carried out for metal substrates and insulating substrates [10,11]. The mechanical state of Cu films on insulating substrates has to be considered carefully [12].…”

Section: Introductionmentioning

confidence: 99%

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Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Sharma

Brüning

Nguyen

et al. 2015

Microelectronic Engineering

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The properties of electroless films produced from a bath designed for horizontal plating, the preferred technology for high production volumes in printed circuit board metallization, are reported. Film thickness, substrate type and electrolyte temperature were varied. Formation of a continuous layer of copper film is correlated with a change in the visual and spectroscopic appearance. Grain orientation is random in thin films and a 〈110〉 texture develops with increasing thickness. The plating solution contains Cu and Ni ions. Nickel co-deposits in copper films in the form of Ni hydroxide, and its concentration decreases from about 6% in the vicinity of the substrate to about 1% at the film surface. Film stress and strain were measured by substrate curvature and X-ray diffraction, respectively. Both stress and strain decrease as the film thickness increases. Stress remains tensile throughout during deposition and during relaxation, promoting film adhesion by preventing blisters. After deposition, stress relaxes first towards compressive and then towards tensile. The stress, the stress relaxation and the Ni concentration are high at the base of the film. We attribute this to the higher volume fraction of grain boundaries (smaller grain size) in this region.

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Section: Local Stressmentioning

confidence: 69%

Section: Time Evolution Of Average Film Stressmentioning

confidence: 82%

Section: Contents Lists Available At Sciencedirectmentioning

confidence: 99%

Section: Time Evolution Of Average Film Stressmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 3 more Smart Citations

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Sharma

Brüning

Nguyen

et al. 2015

Microelectronic Engineering

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Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

Amer

Mrad

Naddaf

2016

Surface & Interface Analysis

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Copper films were coated on beech wood substrates by electroless plating method. The influence of bath temperature on the copper films properties was studied by varying the bath temperatures 25, 35, 45 and 55 °C. Scanning electron microscopy (SEM) equipped with energy dispersive spectroscopy (EDS), X‐ray diffraction (XRD) pattern, X‐ray photoelectron spectroscopy (XPS), micro Raman spectroscopy and contact angle measurements were used to both characterize the physical and chemical copper films properties and understand the influence of bath temperature on the wettability of copper surface. In our studies, we have found that the gained copper mass significantly increased at 55 °C. The crystalline nature of the coated copper was confirmed by XRD. The presence of Cu2O and CuO was observed by XPS and micro Raman techniques, which confirms the oxidization of the coated copper surface. Also these characterization techniques have shown the big influence of bath temperature on the morphology, grain size, chemical composition and the film thickness of the coated copper. The wettability was highly influenced by increasing CuO on the coated copper, which is increased by the bath temperature. The contact angle measurements have demonstrated the influence of C―O, O―CO and CuO components of the surface on the wettability of the samples. Copyright © 2016 John Wiley & Sons, Ltd.

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Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

et al. 2021

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Stress of electroless copper deposits on insulating and metal substrates

Cited by 15 publications

References 12 publications

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Properties of electroless Cu films optimized for horizontal plating as a function of deposit thickness

Influence of bath temperatures on the wettability of copper films surface prepared by electroless plating method on beech wood

Properties of an electroless copper process as a function of nickel and cyanide ion concentrations

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