To achieve insulating materials with
a low-dielectric characteristic
for high-frequency communication applications, three phosphinated
poly(aryl ether)s: P1-act (with acetic moiety), P1-mma (with phenyl
methacrylic moiety), and P1-vbe (with vinylbenzyl ether moiety) were
modified from a phenol-functionalized phosphinated poly(aryl ether)
(P1). P1-act and P1-mma, both with active ester linkages (Ph–O–(C=O)−),
were reacted with three commercial epoxy resins (diglycidyl ether
of bisphenol A, HP7200, and cresol novolac epoxy) to obtain secondary
hydroxyl-free epoxy thermosets. Because of the secondary hydroxyl-free
structure, epoxy thermosets cured by P1-act and P1-mma show an 11–15%
reduction in dielectric constant than those cured by P1. P1-vbe, with
reactive vinylbenzyl ether moieties, was self-cured to a high-performance
thermoset with a
T
g
value as high as 302
°C and a dielectric constant as low as 2.64
U
. High-
T
g
and low-dielectric thermosets
have been developed in this work.