Stresses during the gaseous oxidation of metals

Appleby, W.K.; Tylecote, R. F.

doi:10.1016/s0010-938x(70)80024-5

Cited by 49 publications

(7 citation statements)

References 9 publications

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“…This phenomenon is well accepted but the destiny of metal vacancies is subject to debate and two types of models are well docu-mented in the literature. The first one considers that vacancies diffuse in the metal lattice until they are annihilated at sinks (not always well defined) such as grain boundaries, voids, impurities or dislocations [2][3][4][5][6][7][8][9][10][11][12][13][14][15][16][17]. This process was called vacancy injection by Dunnington [2] in 1952.…”

Section: Introductionmentioning

confidence: 99%

Injection of vacancies at metal grain boundaries during the oxidation of nickel

et al. 2004

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Section: Introductionmentioning

confidence: 99%

Injection of vacancies at metal grain boundaries during the oxidation of nickel

et al. 2004

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“…The other is the change in the crystalline structure and the lattice spacing from monoclinic CuO to cubic Cu 2 O and/or Cu [8] after the reduction process was completed. The volume change from CuO to Cu 2 O was 10.5% [16] and Cu 2 O to Cu was 68% [17]. The expansion of the gap between the columnar structures would allow fast migration of H atoms to the internal Cu x O layer, forming heterogeneous reduction patterns.…”

Section: Reduction Processmentioning

confidence: 99%

Reduction of Copper Oxide Films by an Atmospheric-Pressure Inductively Coupled Plasma Microjet

Tajima

Tsuchiya

Matsumori

et al. 2010

Trans. Mat. Res. Soc. Japan

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Local reduction of the copper oxide film was performed by an atmospheric-pressure inductively coupled plasma (AP-ICP) microjet and the fundamental characteristics of the removal process were studied. CuO and Cu 2 O films were formed on the sputtered Cu surface by thermal annealing. The sample was then exposed to the Ar-H 2 AP-ICP microjet. The chemical composition, morphology, and the film thickness before and after the plasma treatment were analyzed by XPS, optical microscopy, and SEM/EDX. CuO and Cu 2 O were reduced to form porous Cu at the speed of 380 nm/min. Heterogeneous reduction patterns inside the Cu 2 O layer were observed due to the fast diffusion of H atoms through the narrow gap between the columnar structures.

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“…for scales on pure Ni 34 • 37 , Cu 37 · 45 • 46 , Fe and Febased alloys 47 • 48 , Cr 33 · 49 , Zr and Zr alloys 37 and MCrAI(Y) alloys 2 1.3 2 . 50 • 51 ).…”

Section: Intrinsic Growth Stressesmentioning

confidence: 99%

Stresses generated during oxidation sequences and high temperature fracture

Huntz

Schütze

1994

Materials at High Temperatures

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This paper deals with the stresses generated during high temperature oxidation and their relationship to scale fracture. In the first part, the objective is to differentiate growth stresses from thermal stresses and give evidence for relaxation phenomena. The results obtained for materials which develop NiO, Cr 2 0 3 or Ah0 3 scales indicate that, in most cases, growth stresses in the oxide films are negligible compared to thermal stresses, probably on account of stress relaxation at high temperature. Moreover, the stress sign in the oxide scale is inconsistent with conventional views based on the Pilling-Bedworth ratio, but closely related to the growth mechanism of the oxide: a preponderantly cationic diffusion leads to tensile stresses, whereas a preponderantly anionic diffusion leads to compressive stresses. Thermal stresses are closely related to the differences between the expansion coefficients of the scale and the substrate, but can be modified by parameters which can promote stress relaxation such as the cooling rate, the thickness of the film or the thickness of the substrate. In the second part, the objective is to relate growth stress to scale fracture. Growth stresses in oxide scales may be geometrically induced, of intrinsic nature or caused by epitaxial constraints or phase changes. The first two types in particular may lead to local scale failure whereby the number and size of physical defects determine the failure stresses or strains. While more experimental data on intrinsic growth stresses can now be found in the literature, no data exist for geometrically induced stresses. These can, however, be estimated from scale growth kinetics. The level of the kinetics shows their significance for scale failure, and thus it is recommended that more experimental work be done in this field.

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Stresses during the gaseous oxidation of metals

Cited by 49 publications

References 9 publications

Injection of vacancies at metal grain boundaries during the oxidation of nickel

Injection of vacancies at metal grain boundaries during the oxidation of nickel

Reduction of Copper Oxide Films by an Atmospheric-Pressure Inductively Coupled Plasma Microjet

Stresses generated during oxidation sequences and high temperature fracture

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