Stresses evolution at high temperature (200°C) on the interface of thin films in magnetic components

Abstract

Abstract.In the field of electronics, the increase of operating temperatures is a major industrial and scientific challenge because it allows reducing mass and volume of components especially in the aeronautic domain. So minimizing our components reduce masses and the use of cooling systems. For that, the behaviours and interface stresses of our components (in particular magnetic inductors and transformers) that are constituted of one magnetic layer (YIG) or an alumina substrate (Al 2 O 3 ) representing the substrate and a thin copper film are studied at high temperature (200°C). COMSOL Multiphysics is used to simulate our work and to validate our measurements results. In this paper, we will present stresses results according to the geometrical copper parameters necessary for the component fabrication. Results show that stresses increase with temperature and copper's thickness while remaining always lower than 200MPa which is the rupture stress value.

Thermal Characterization of Electronic Power Component: a comparison between resistive and fiber Bragg grating sensors

“…Hence, expression ( 9) can be extended to the temperature dependence of the resistance R of a component by using the well-known formula R = ρL/S, where L is the conductor length and S its section. According to (9), it is possible to measure the temperature change of a resistive component by measuring its resistance at two different temperatures if its thermal coefficient is known:…”

“…Secondly, as electronic components are constituted of several materials, the difference in thermal expansion between materials can induce strain inside the component. In some cases, cracks can appear, and layers can lift away leading to the component destruction [9]. Then, it is important to estimate real temperature reached inside an electronic component during operation to ensure viability of circuit [10].…”

On thermal characterization method of integrated magnetic components

“…Secondly, as electronic components are constituted of several materials, the difference in thermal expansion between materials can induce strain inside components. In some cases, cracks can appear, and layers can lift away leading to the component destruction 9 . Then, it is important to estimate real temperature reached inside an electronic component during operation to ensure viability of circuit 10 .…”