DC-pulse magnetron sputtering was used to deposit a 300-nm-thick Si–Sn codoped n-type GaN film on an amorphous glass substrate with a ZnO buffer layer. Postgrowth thermal annealing at 300, 400, or 500 °C was performed to improve the crystal quality of the GaN thin films. Hall measurements revealed that the film annealed at 500 °C had the lowest thin-film resistance of 0.82 Ω cm and highest carrier concentration of 3.84 × 1019 cm−3. Atomic force microscopy was used to investigate the thin-film surface morphology; the film annealed at 500 °C had an average grain size and surface roughness of 25.3 and 2.37 nm, respectively. Furthermore, the X-ray diffraction (XRD) measurements revealed a preferential (002) crystal orientation and hexagonal wurtzite crystal structure at 2θ ≈ 34.5° with a narrow full width at half maximum value of 0.387°. Compositional analysis of the films was conducted with Xray photoelectron spectroscopy and verified that both Si and Sn were doped into the GaN film by means of covalent bonding with N atoms. Finally, the film annealed at 500 °C had a high optical transmittance of 82.9% at 400–800 nm, a high figure of merit factor of 490.3 ×10−3 Ω−1, and low contact resistance of 567 Ω; these excellent optoelectronic properties were attributed to the film’s high electron concentration and indicate that the material is feasible for application in transparent optoelectronic devices.