2008
DOI: 10.1016/j.apsusc.2007.10.025
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Structural characterization of nc-Si films grown by low-energy PECVD on different substrates

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Cited by 27 publications
(20 citation statements)
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“…Furthermore, X-ray diffraction analyses carried out according to the experimental setup, as well as the elaboration methods reported in Ref. 9, confirmed that the mean crystallite sizes in the present samples ranged between 5 and 12 nm, thus leading to the observed redshift of the nc-Si Raman peak position. 16 As nc-Si is a mixed phase material in which small crystallites are surrounded by an amorphous tissue, 17 the film growth was often explained by vapor phase models similar to those used for amorphous silicon films.…”
supporting
confidence: 74%
See 1 more Smart Citation
“…Furthermore, X-ray diffraction analyses carried out according to the experimental setup, as well as the elaboration methods reported in Ref. 9, confirmed that the mean crystallite sizes in the present samples ranged between 5 and 12 nm, thus leading to the observed redshift of the nc-Si Raman peak position. 16 As nc-Si is a mixed phase material in which small crystallites are surrounded by an amorphous tissue, 17 the film growth was often explained by vapor phase models similar to those used for amorphous silicon films.…”
supporting
confidence: 74%
“…A problem arising in the region of growth parameters used to obtain such a crystallinity is that the microstructure of the resulting intrinsic layer was shown to be inhomogeneous along the growth direction. 8,9 Conversely, from the aspects of photovoltaic application, it is very important to obtain the smallest differences in the texture along the growth direction, as a uniform microstructure must yield a uniform electric field in the intrinsic layer, resulting in high fill factors and open-circuit voltages. 10 In the present work, nc-Si samples were grown by LEPECVD 11 using different SiH 4 and H 2 fluxes, all yielding the same dilution factor.…”
mentioning
confidence: 99%
“…Several nc-Si:H films, grown on different substrates (silicon, oxidized silicon, Corning glass, ITO and ZnO on Corning glass) by LEPECVD (low energy plasma enhanced chemical vapour deposition) were examined. Further details on the deposition conditions and structural properties of the films can be found in [11,12]. Among the CVD variant growth methods used for producing nc-Si:H (such as hot wire CVD and the standard plasma enhanced CVD), LEPECVD is of major interest due to the low ion energy, which causes only limited surface damage.…”
Section: Methodsmentioning
confidence: 99%
“…The LEPECVD process [17,18] allows deposition of nc-Si films with Raman crystallinity v = 50% at fast growth rates (1-3.5 nm/s) and low substrate temperatures (250°C) at low pressures p * 2.5 Pa for relatively low dilutions (d = 0.3 ± 0.05) at constant discharge parameters [19,20] ensuring efficient gas utilization.…”
Section: Introductionmentioning
confidence: 99%