2017 40th International Convention on Information and Communication Technology, Electronics and Microelectronics (MIPRO) 2017
DOI: 10.23919/mipro.2017.7966577
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Structural integrity optimization of 3D TSV package by analyzing crack behavior at TSV and BEOL

Unique Rahangdale
1
,
Aniruddha Doiphode
2
,
Pavan Rajmane
3
et al.
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