2012
DOI: 10.1016/j.jnoncrysol.2011.12.043
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Structural regulation of electrochemically deposited copper layers for fabrication of thin film solar cells with a CuInS2 photoabsorber

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Cited by 17 publications
(7 citation statements)
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“…[15] Furthermore, the development of thin-film fabrication techniques enable the preparation of high-quality CuInS 2 photoelectrodes by a low-cost electrodeposition method. [16][17][18] For efficient PEC H 2 evolution, efficient separation of the photogenerated electrons and holes is extremely important. We have reported that surface modification using thin n-type layers of, for example, CdS enhances the cathodic photocurrent from CuGaSe 2 , Cu-(In,Ga)Se 2 , and Cu 2 ZnSnS 4 photocathodes through the formation of a p-n junction on the surface of the photocathodes.…”
mentioning
confidence: 99%
“…[15] Furthermore, the development of thin-film fabrication techniques enable the preparation of high-quality CuInS 2 photoelectrodes by a low-cost electrodeposition method. [16][17][18] For efficient PEC H 2 evolution, efficient separation of the photogenerated electrons and holes is extremely important. We have reported that surface modification using thin n-type layers of, for example, CdS enhances the cathodic photocurrent from CuGaSe 2 , Cu-(In,Ga)Se 2 , and Cu 2 ZnSnS 4 photocathodes through the formation of a p-n junction on the surface of the photocathodes.…”
mentioning
confidence: 99%
“…Thus, CuInS 2based solar cells show a high solar-energy conversion efficiency of 11.4 %. [16][17][18] For efficient PEC H 2 evolution, efficient separation of the photogenerated electrons and holes is extremely important. [15] Furthermore, the development of thin-film fabrication techniques enable the preparation of high-quality CuInS 2 photoelectrodes by a low-cost electrodeposition method.…”
mentioning
confidence: 99%
“…Although Bi et al (2016) eliminated the dendritic morphology of Cu on Mo via a pulse current electrodeposition method, the problem of dendritic clusters appeared again after the Cu thickness was reduced. To fabricate dendritic-cluster-free and smooth Cu films via electrodeposition, numerous studies have been conducted (Norkus et al, 2005;Moffat et al, 2007;Lee et al, 2012). Among them, adding organic additives in the electrodepositing solution could help reduce the surface roughness of Cu films and improve their flatness (Long et al, 2006;Favry et al, 2008).…”
Section: Introductionmentioning
confidence: 99%