Structural shock verification by numerical analysis of the EPD payload units on board Solar Orbiter spacecraft

García-Pérez, Andrés; Ravanbakhsh, Alí; Sorribes-Palmer, Félix; Alonso, G.

doi:10.1016/j.actaastro.2019.12.026

Cited by 9 publications

(5 citation statements)

References 9 publications

Supporting

Mentioning

Contrasting

Unclassified

Order By: Relevance

“…For near-field pyroshock analysis, the explosive excitations are advised where high acceleration and high frequency can be obtained to verify structural integrity issues (see, e.g., [4,5,9]). On the other hand, for the simulation of the mid-and far-field environments, mechanical excitations can be used through metal-to-metal impact, pneumatic impact or an electrodynamic shaker (see, e.g., [4,5,7,10,11]). While electrodynamic shakers are limited to far-field pyroshock environments, metal-to-metal impact and pneumatic impact systems can simulate mid-field effects.…”

Section: Introductionmentioning

confidence: 99%

“…These curves are composed of the peak acceleration response of the real system as if it is a single degree of freedom (SDOF) setup that has a resonant frequency all over the frequency bands that are to be considered. Using SRS curves provides a convenient method to compare the severity levels of different shock loadings, and it is preferred in a number of different works in the literature (see, e.g., [6][7][8][9][10][11][12][13][14][15][16][17][18]).…”

Section: Introductionmentioning

confidence: 99%

“…The authors mention that the FE method can be adequate to analyze small structures such as space instruments subjected not to near-or mid-but a far-field shock load, because its response is mainly dominated by the modal behavior. Other main approaches in the literature are the statistical energy analysis (SEA) method (see, e.g., [21,22]), and the hydrocode modeling of the system (see, e.g., [8,10,13,23]). Hydrocodes can predict the behavior in the near-, mid-and far-field through time domain analysis; however, they are considered not to be satisfying in terms of accuracy and require high computation times.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Numerical Validation of a Pyroshock Test System and Application to Qualification Tests

Yalçınkaya

Gürsoy

2022

Aerospace

View full text Add to dashboard Cite

Spacecraft are exposed to severe mechanical loads, i.e., shock loads, during their journey to orbit. Such loads usually develop due to a separation event through the activation of pyrotechnic devices. They might be transmitted throughout the entire structure and strongly influence the service performance of electronic components. Therefore, it is crucial to study whether the instruments can resist such a harsh environment. However, due to the vulnerability and high cost of the equipment, experimental setups are required to be designed and calibrated with dummy equipment, which takes considerable time and effort as well. In this context, the current study aims to investigate the potential of explicit FE solution techniques to mimic the calibration tests. In order to realize this, various experiments are conducted in a metal-to-metal impact pyroshock test bench and the obtained Shock Response Spectrum (SRS) responses are fitted to the explicit finite element simulations, which shows good agreement after a sensitivity analysis. Then, the simulations are repeated with the dummy device using the fitted parameters, and the potential of the numerical approach to predict a realistic response is discussed.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Numerical Validation of a Pyroshock Test System and Application to Qualification Tests

Yalçınkaya

Gürsoy

2022

Aerospace

View full text Add to dashboard Cite

show abstract

“…The application of these packages allows a printed circuit board (PCB) to be compact in volume, as they provide a high number of inputs/outputs and processing capabilities. Meanwhile, the mechanical engineering sector has focused on the minimization of the bulkiness of housing structures to integrate the PCB as the housing typically occupies more than 50% of the mass budget of the electronics [5,6]. Nevertheless, the housing structure shall provide sufficient strength and stiffness to prevent the failure of electronics during test and service periods.…”

Section: Introductionmentioning

confidence: 99%

New Version of High-Damping PCB with Multi-Layered Viscous Lamina

Park¹,

Shin

2021

Aerospace

View full text Add to dashboard Cite

In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlaminated layers. For the efficient spatial accommodation of electronics, this paper proposes a new version of a high-damping PCB with multilayered viscoelastic tapes interlaminated on a thin metal stiffener spaced from a PCB. Compared to the previous study, this concept ensures efficient utilization of the PCB area for mounting electronic parts as well as the vibration attenuation capability. Free vibration tests were performed at various temperatures to obtain the basic characteristics of the proposed PCB. The effectiveness of the proposed PCB was verified by random vibration fatigue tests of sample PCBs with various numbers of viscoelastic layers to compare the fatigue life of electronic packages.

show abstract

“…Застосування цих пакетів дозволяє друкованій платі (друкованій платі) бути компактним за обсягом, оскільки вони забезпечують велику кількість входів/виходів та можливості обробки. Тим часом машинобудівний сектор зосередився на мінімізації масовості житлових конструкцій для інтеграції друкованої плати, оскільки корпус зазвичай займає більше 50% масового бюджету електроніки [5,6]. Тим не менш, конструкція корпусу повинна забезпечувати достатню міцність та жорсткість для запобігання виходу з ладу електроніки під час випробувань та періодів обслуговування.…”

unclassified

Особливості Монтажу Та Складання Друкованих Плат.

Павленко¹

2021

cit

View full text Add to dashboard Cite

У статті було досліджено друковану плату, створену за допомогою багатошарових еластичних акрилових стрічок, щоб збільшити ресурс зносостійкості паяних з'єднань електронних пакетів шляхом послаблення вібрації в середовищі випадкових вібрацій. Визначено, що основним недоліком цієї концепції є її неможливість встановити електронні деталі на площі поверхні зовнішнього шару друкованої плати. Для ефективного просторового розміщення електроніки в цій роботі пропонується нова версія високодіючої друкованої плати з багатошаровими стрічками, посилена на тонкому металевому ребрі жорсткості, окремо від друкованої плати. Ця концепція забезпечує ефективне використання зони друкованої плати для монтажу електронних деталей, а також можливість послаблення вібрації.

show abstract

Structural shock verification by numerical analysis of the EPD payload units on board Solar Orbiter spacecraft

Cited by 9 publications

References 9 publications

Numerical Validation of a Pyroshock Test System and Application to Qualification Tests

Numerical Validation of a Pyroshock Test System and Application to Qualification Tests

New Version of High-Damping PCB with Multi-Layered Viscous Lamina

Особливості Монтажу Та Складання Друкованих Плат.

Contact Info

Product

Resources

About