In a previous study, a high-damping printed circuit board (PCB) implemented by multilayered viscoelastic acrylic tapes was investigated to increase the fatigue life of solder joints of electronic packages by vibration attenuation in a random vibration environment. However, the main drawback of this concept is its inability to mount electronic parts on the PCB surface area occupied by interlaminated layers. For the efficient spatial accommodation of electronics, this paper proposes a new version of a high-damping PCB with multilayered viscoelastic tapes interlaminated on a thin metal stiffener spaced from a PCB. Compared to the previous study, this concept ensures efficient utilization of the PCB area for mounting electronic parts as well as the vibration attenuation capability. Free vibration tests were performed at various temperatures to obtain the basic characteristics of the proposed PCB. The effectiveness of the proposed PCB was verified by random vibration fatigue tests of sample PCBs with various numbers of viscoelastic layers to compare the fatigue life of electronic packages.

The main objective of the S-STEP (the Small Synthetic Aperture Radar (SAR) Technology Experimental Project (S-STEP)) mission is developing an 80-kg-class active X-band SAR observation small satellite. For lighter, smaller, better, and cheaper development of the S-STEP system, a new thermal design strategy is essential. Therefore, we proposed a new thermal design strategy in this study. The main features of the proposed thermal design involve the minimization of heater power consumption by optimizing environmental heat fluxes on the satellite, the provision of long-term SAR imaging duration in both right- and left-looking modes, and the use of a lightweight flexible graphite sheet as a thermal interface for some high-power instruments. These features contribute to minimizing the satellite’s mass budget through heater power minimization and achieving on-orbit system performance of S-STEP. The effectiveness of the proposed thermal design was numerically verified by on-orbit thermal analysis of the S-STEP system. In addition, the thermal design on a key payload component and the multifunctional transmit/receive module structure were verified through a space-simulated thermal vacuum test.

This research discusses the change in radio frequency (RF) characteristics according to the number of Gores on the deployable mesh antennas for potential micro-satellite applications. The deployable type of lightweight mesh antenna can be used for various space missions such as communication/SAR/ SIGINT.In order to implement an ideal curvature of antenna surface, sufficient number of antenna rib structures are required. However, the increase in antenna ribs affects various design factors of the antenna system, especially total system mass, complexity of deployable mechanism and reliability. In this paper, the proper number of ribs for the mesh antenna were derived by comparison of electro-magnetic (EM) simulation results of example of antenna model in accordance with the various number of ribs.