“…5 The forming gas annealing is required to passivate the device and eliminate defects at the transistor interface. [8][9][10] Although the hydrogen degradation can be reduced by using conductingoxide electrodes, such as La 0.5 Sr 0.5 CoO 3 , 11 SrRuO 3 , 12 and ͑Ba, Sr͒RuO 3 , 13 patterning the above oxide electrodes by dry etching technique is troublesome and the use of them also gives a high leakage current. The degradation by forming gas annealing leads to the loss of polarization in ferroelectric capacitors, which is related to the catalytic characteristic of electrode material, especially Pt, 6,7 in dissociation of the hydrogen molecule into atoms.…”