“…In microelectronic applications, Ta 2 O 5 thin film is used in highdensity dynamic-random-access memories (DRAMs) as well as in metal-oxide-semiconductor field-effect transistors (MOSFETs) due to its high dielectric constant, high chemical, thermal stability, low leakage-current density and being compatible with the microelectronic processing technology [6,7]. Deposition techniques such as thermal evaporation [8], rf and dc reactive magnetron sputtering [9,10], electron beam evaporation [11], pulsed laser deposition [12], atomic layer deposition [13], and metal-organic chemical vapor deposition [14] are employed for deposition of Ta 2 O 5 thin films. Among these techniques, reactive magnetron sputtering has the advantage in the preparation of uniform films on large area substrates by sputtering of metallic tantalum target in the presence of reactive gas of oxygen.…”