Structure and stress of Cu films prepared by high power pulsed magnetron sputtering

Ma, D.L.; Jing, P.P.; Gong, Y.L.; Wu, Baohua; Deng, Qiuju; Li, Y.T.; Chen, C.Z.; Leng, Y.X.; Huang, Nan

doi:10.1016/j.vacuum.2018.11.039

Cited by 17 publications

(4 citation statements)

References 30 publications

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“…4 Good adhesion between Cu and PI layers is another challenge for the printed circuits on flexible substrates. 5,6 Copper oxide (CuO) is considered a suitable material as the anti-reflection (AR) layer due to its black color. 7−9 By tuning the morphology of the AR layer or the interface layer, the adhesion of the AR layer to the substrate could be slightly improved.…”

Section: Introductionmentioning

confidence: 99%

“…Transparent polyimide (PI) is one of the candidate substrates for transparent flexible displays due to its excellent optical transmittance, high thermal stability, superior mechanical strength, low dielectric constant, and excellent chemical solvent resistance. − However, if the transparent PI was directly sputtered with copper (Cu), the electronic circuits on PI will be visible by the naked eyes due to the high reflectivity of Cu . Good adhesion between Cu and PI layers is another challenge for the printed circuits on flexible substrates. , …”

Section: Introductionmentioning

confidence: 99%

“… 4 Good adhesion between Cu and PI layers is another challenge for the printed circuits on flexible substrates. 5 , 6 …”

Section: Introductionmentioning

confidence: 99%

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Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

et al. 2023

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Parameters of DC-reactive magnetron sputtering are optimized to deposit anti-reflection (AR) layers on transparent polyimide (PI) substrates, followed by the deposition of the conductive copper layer, to fabricate practically reliable composite films as advanced flexible circuits. When the deposition thickness is controlled and the gas composition during sputtering is adjusted, the resultant AR layer-coated PI film exhibits low reflectance and reveals improved adhesion strength to the copper layer. The adhesion reliability tests confirm that the peel strength between the PI film and the deposited layers could be further improved after thermal processing due to the formation of a worm-like morphology for better mechanical interlocking with layers. The facile sputtering process successfully fabricates a reliable substrate material with low reflectance and sufficient adhesion strength to copper for application as flexible printed circuits.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Anti-reflection Layer-Sputtered Transparent Polyimide Substrate with Reliable Adhesion Strength to the Copper Layer

et al. 2023

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“…In the integrated circuit and microelectronic device industry, Cu is widely used because of its good conductivity, excellent heat conductivity and high electromigration resistance [17–20]. The Cu nanometer film can be employed as electrode and connection material of the thin film transistor and the energy conversion device [21, 22].…”

Section: Introductionmentioning

confidence: 99%

Effects of Preparation Methods for Cu Foil on the Electric‐Explosion Properties

Qin

et al. 2021

Propellants Explo Pyrotec

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In order to study the different structural characteristics and electric explosion properties of Cu foils prepared by different methods, Cu films were prepared by electron beam evaporation, electroplating, evaporation, and magnetron sputtering in this work. The morphology and structure of the Cu films were characterized by SEM, AFM, XRD. Furtherly, the Cu films were separately etched into a bridge foil shape to measure the explosion process of the Cu foil in the discharge circuit at the charging voltage of 3000 V, and the resistance and deposition energy were calculated. The results showed that the particle size and surface roughness of Cu foil prepared by evaporation was smallest, and the crystallization peak of Cu (111) texture was strongest. The surface roughness of the Cu foil prepared by magnetron sputtering was the largest, and the peak voltage was the highest of 1640 V. The Cu foil prepared by electroplating had the smallest initial resistance and the longest time to reach the peak resistance during the explosion process. The deposition energy of the Cu film is 93.37 mJ, which is the largest. Among these methods, the Cu foil prepared by electroplating is more conducive to energy conversion.

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