Structure-stress-resistivity relationship in WTi alloy ultra-thin and thin films prepared by magnetron sputtering

Priol, A. Le; Bourhis, E. Le; Renault, P.-O.; Müller, Pierre; Sik, H.

doi:10.1063/1.4808240

Cited by 8 publications

(5 citation statements)

References 49 publications

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“…A new paper, which discusses the effect of the impurity and morphology to be given to the resistance in this alloy system (W-rich side range) films appeared recently [5]. The paper presents that the resistivity and surface roughness increase greatly with Ar gas pressures around of 1 Pa.…”

Section: Resultsmentioning

confidence: 97%

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Electrical resistivity and its thermal coefficient of TiW alloy thin films prepared by two different sputtering systems

Sakurai

Takeda

Ikeda

et al. 2014

Phys. Status Solidi C

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Electrical resistivity and its thermal coefficient (TCR) of TiW alloy thin films which were prepared by using two different sputtering systems have been investigated. System A is a DC‐magnetron sputtering system equipped with a single composite‐target that allows the contents controllable by an external field of solenoid as reported in previous papers (Sakurai and Takeda, Abstract of E‐MRS 2005 Fall Meeting [1] and Sakurai et al., Solid State Phenom. 154, 175 (2009) [2]). The system A prepared specimens with the range of 21.6 to 36.6 at% of W‐contents. The TCR varies from minus to plus at 32 at% of W‐content. On the other hand, System B is a RF‐magnetron sputtering system equipped with multi‐targets and multi‐sputtering‐sources. The system B covered the whole binary composition ranges by controlling power ratio for two independent sputtering sources. The resistivity characteristics show a parabolic curve with the maximum value on Ti‐rich contents. The TCR decreases at the contents that shows the maximum resistivity, but the TCR is always plus and does not cross zero. Difference of the properties by using the two systems will be discussed. In the system A, the background is exhausted by an oil diffusion pump and the pressure is higher (lower vacuum degree) than the background in the system B with a turbo molecular pump. This suggests that zero TCR would be achieved by introducing the controlled impurities (O2 or N2) into the binary alloy films. (© 2014 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

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Section: Resultsmentioning

confidence: 97%

“…Recently, the electrical resistivity of sputtered TiW thin film had been studied by Glebovsky et al [3,4], and Le Priol et al [5], however the thermal coefficient have not been measured. We have prepared the films by using a DC magnetron sputtering system and found a zero TCR (thermal coefficient of resistivity) alloy film in this binary alloy system.…”

mentioning

confidence: 99%

Electrical resistivity and its thermal coefficient of TiW alloy thin films prepared by two different sputtering systems

Sakurai

Takeda

Ikeda

et al. 2014

Phys. Status Solidi C

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“…It has been understood that the heavier W atoms (183.84 amu) will sputter in a more ballistic manner, which is not the case for Ti atoms (47.867 amu) [37,38]. The Ti atoms are scattered more rapidly due to the gas atoms therefore enhancing energy losses in the Ti deposition flux [38,39].…”

Section: Film Thicknessmentioning

confidence: 97%

“…Furthermore, as discussed under the film thickness variation, the relative differences in the sputtering yield and oxidation also confirms the variation in composition from target to film. In addition, for W-Ti alloy targets, there are several reports that confirm film composition deviations from that of the alloy target due to preferential sputtering and gas phase scattering phenomena [37][38][39]. XPS depth-profiling on the WO 3 -TiO 2 films was performed to determine the film chemistry, and possible changes with depth.…”

Section: Page 14 Of 34mentioning

confidence: 98%

Effect of W–Ti target composition on the surface chemistry and electronic structure of WO3–TiO2 films made by reactive sputtering

Vargas

López

Murphy

et al. 2015

Applied Surface Science

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A c c e p t e d M a n u s c r i p t 2 Highlights  An approach to fabricate WO 3 -TiO 2 thin films using W-Ti alloy target is presented. The effect of W-Ti ratio on the surface chemistry of W-Ti-O oxide films is evaluated. Increasing Ti decreases W-Ti-O film thickness drastically due to sputtering kinetics. Optimum conditions to deposit stoichiometric WO 3 -TiO 2 films are reported. ABSTRACTTungsten-titanium (W-Ti) mixed oxide thin films were fabricated using reactive sputtering of W-Ti alloy targets with Ti content ranging from 0 to 30 wt.%. The effect of target composition on film structure, surface/interface chemistry and chemical valence state of the W and Ti cations was investigated in detail. All films were amorphous in nature as confirmed by X-ray diffraction analyses. For growth times of 1 hour, the thicknesses of the W-Ti-O films decreased significantly from 150 nm to 35 nm with increasing Ti content in the target, confirming that the oxide film growth behavior is dependent on the sputter-target composition.The chemistry and composition of the films probed using X-ray photoelectron spectroscopy (XPS) confirms the existence of W and Ti in their highest oxidation states of 6+ and 4+, respectively. Quantification of binding energy shifts for W and Ti core-level transitions confirms the formation of WO 3 -TiO 2 composite oxide films. Depth profiles confirm and validate film uniformity, as well as film thickness differences and variable oxidation behavior of W and Ti in the films.

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“…Another solid-state method highly useful in welding/cladding different elements cannot be cladded by any other methods [ 43 , 44 , 45 , 46 , 47 , 48 ] and results in a dependable and robust bond. It includes chemical reactions that promote explosive detonations at very high velocity in a controlled manner to force the substrate and the coating together at elevated pressures temperatures [ 49 , 50 ].…”

Section: Literature Studymentioning

confidence: 99%

Performance Comparison of Advanced Ceramic Cladding Approaches via Solid-State and Traditional Welding Processes: A Review

et al. 2020

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Ceramic coating has applications in enhancing the material’s properties and can significantly improve the material’s usability in varied temperatures and adverse operating conditions and widen its applicability scope. It can add to the various properties such as wear resistance, high-temperature degradation, thermal conductivity, material toughness, tensile strength, corrosion resistance, friction reduction, electric insulation, and the lifespan of the material. Various techniques have been suggested and implemented to achieve ceramic coating on a metal surface, each having their respective advantages and disadvantages. Hence, they can be distinguished for their applicability in different places. The bonding mechanism of metal particle systems has been researched to date, but there are still certain uncertainties regarding the ceramic particle system because of the dissimilarities in properties. The paper aims to profoundly investigate the various coating technologies available through welding processes and do a comparative study through numerical analysis and experimental results on the properties of coatings obtained from two broad categories of welding—solid-state and traditional/fusion processes. It was found that the solid-state processes in which the temperature remained well below the fusion temperatures overcame the mismatch in property and produced reliable coatings with enhanced mechanical properties.

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Structure-stress-resistivity relationship in WTi alloy ultra-thin and thin films prepared by magnetron sputtering

Cited by 8 publications

References 49 publications

Electrical resistivity and its thermal coefficient of TiW alloy thin films prepared by two different sputtering systems

Electrical resistivity and its thermal coefficient of TiW alloy thin films prepared by two different sputtering systems

Effect of W–Ti target composition on the surface chemistry and electronic structure of WO3–TiO2 films made by reactive sputtering

Performance Comparison of Advanced Ceramic Cladding Approaches via Solid-State and Traditional Welding Processes: A Review

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