Studies on FMCM-41 reinforced cyanate ester nanocomposites for low k applications

Abstract

The continual development of microelectronics needs insulation materials with lower dielectric constant (low k).

Cyanate ester tethered POSS/BACY nanocomposites for low-k dielectrics

“…5) shows the binding energies of elemental peaks at 283 eV, 532 eV, 398 eV, and 102 eV are correspond to C1s, O1s, N1s, and Si2p, respectively [15] ( Fig. 5b-d).…”

“…Figure 5b shows the deconvolution of C1s signal, the major peak at 283.2 eV corresponds to C-C, C = C and Si-C bonds and the second major peak at 284.7 eV are associated to the C-O-C bonds. [15,[19][20][21] Subsequently, the third peak at 287.5 eV represents the C = O bond of isocyanurate ring. [22] In addition, the characteristic O1s signal was deconvoluted into three peaks (Fig.…”

“…In addition, the pores were filled by air/vacuum which has a dielectric constant of about 1 which could contribute to reduce the value of dielectric constant of the materials. [11,15] The dielectric loss of insulating materials is also one of the important factors in the reduction of crosstalk and power consumption in ultra large scale integrated circuits. Figure 9b and Table 1 show the dielectric loss values of neat BACY and varying weight percentages of BACY/POSS-OCN nanocomposites.…”

Novel tough and thermally stable cyanate ester resins with high flame retardancy, low dielectric loss and constant based on a phenolphthalein type polyarylether sulfone

“…It is well known that the extremely low dielectric constant and loss over a wide frequency range have been the most prominent advantage of CE resin compared with other thermally resistant TS resins, 43 it is also the main reason that CE resin has great prospect in microelectronics field. 44 Please do not adjust margins Therefore, maintaining excellent dielectric properties is of great importance for toughening CE resin.…”

“…[17][18][19] So we selected CE resin as the base resin for developing new high performance resins. Herein, a series of cPES/CE resins were prepared through meltblending without using solvent, and the relatively good compatibility with small content of cPES was obtained, ensuring the good manufacturability.…”