Studies on Preparation and Property Researches of EP/SiC Thermal Conductivity Composites

Luo, Yu; Dang, Jing; Hu, Qi; Li, Huirong

doi:10.1080/03602550902994953

Cited by 12 publications

(3 citation statements)

References 14 publications

(13 reference statements)

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“…Until now, many researchers have studied the effect of the addition of high thermal conductivity fillers to enhance the thermal properties of polymer composites [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15] . For example, some excellent thermal conductive plastic composites have been successfully obtained from different kinds of thermal fillers including oxide (Al 2 O 3 , SiO 2 and BeO) [1][2][3][4][5][6][7] , carbide (SiC) [8,9] , nitride (AlN and BN) [10][11][12] , carbon materials (graphite and carbon nanotubes) [13][14][15] , and various polymer matrix such as high density polyethylene (HDPE), linear low density polyethylene (LLDPE), ABS, polyamide, polypropylene, etc.…”

Section: Introductionmentioning

confidence: 99%

Thermal, Mechanical and Electrical Properties of Linear Low-Density Polyethylene Composites Filled with Different Dimensional SiC Particles

Ren

et al. 2011

Polymer-Plastics Technology and Engineering

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Thermally conductive composite film was obtained from silicon carbide (SiC) and linear low-density polyethylene (LLDPE) by powder mixing and hot press molding. SiC powder distributions were found to be relatively rather uniform at both low (20 wt.%) and high (60 wt.%) filler content. The effect of the content and the particle diameter of filler on the properties of SiC/LLDPE composites was investigated by thermal conductivity measurement, TGA, tensile test and dielectric properties measurement. The results demonstrated that the thermal conductivity and dielectric constant of LLDPE film increased from 0.32 Wm À1 K À1 and 2.10 to 0.98 Wm À1 K À1 and 4.18 with 50 wt.% SiC loading. The TGA data showed SiC filler slightly increased the thermal stability of LLDPE. While the tensile properties of LLDPE obviously decreased with the increase of SiC. Compared with the untreated SiC filler, KH-550 slightly improved the thermal conductivity of SiC/LLDPE composites. For thermal conductivity, smaller particle is superior to larger particle. Compared to that with single-scale particle, the composites filled with hybrid SiC particle exhibited higher thermal conductivity.

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Section: Introductionmentioning

confidence: 99%

Thermal, Mechanical and Electrical Properties of Linear Low-Density Polyethylene Composites Filled with Different Dimensional SiC Particles

Ren

et al. 2011

Polymer-Plastics Technology and Engineering

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“…Phenolic resin (Ep) is a thermoset material, and it consists of a 3-D network structure in the as-cured condition having an amorphous and glassy structure with a high cross-linking density of CF, and SiC, on the other hand, restricts the movement of molecules, thus resulting in higher T g . 16,17 From Figure 9 and Table 1, the initial decomposition temperature for 5% weight loss (T 5 ), the decomposition temperature at 10% weight loss (T 10 ), and maximum decomposition temperature (T d ) of the composite were measured.…”

Section: Resultsmentioning

confidence: 99%

Enhanced thermal and electrical properties of epoxy/carbon fiber–silicon carbide composites

Kareem

2020

Advanced Composites Letters

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The silicon carbide/carbon fiber (SiC/CF) hybrid fillers were introduced to improve the electrical and thermal conductivities of the epoxy resin composites. Results of Fourier transform infrared spectroscopy revealed that the peaks at 3532 and 2850 cm−1 relate to carboxylic acid O–H stretching and aldehyde C–H stretching appearing deeper with an increased volume fraction of SiC. Scanning electron microscopic image shows a better interface bonding between the fiber and the matrix when the volume fraction of SiC particles are increased. As frequency increases from 102 Hz to 106 Hz, dielectric constants decrease slightly. Dissipation factor (tan δ) values keep low and almost constant from 102 Hz to 104 Hz, has a slight increase after 104 Hz, and obtain relaxation peaks approximately between 105 and 106 Hz. A sharp increase in dielectric constant and dissipation factors is observed in epoxy (Ep)/CF composites with 30 vol.% of SiC. The increase in electrical conductivity of composites may result from the increased chain ordering by annealing effect. The electrical conductivities of the Ep/CF composites are decreasing with the increasing volume fraction of SiC. It is attributed to the introduction of insulating SiC. The glass transition temperature ( T g) of the Ep/CF-30 vol.% SiC composite was 352 C, which was higher than other composites. The decomposition temperature at 5% weight loss, decomposition temperature at 10% weight loss, and maximum decomposition temperature of the Ep/CF-30 vol.% SiC composite were about 389.5°C, 410.7°C, and 591°C, respectively, and were higher than pure epoxy and other composites. A higher thermal conductivity of 1.86 W (m K)−1 could be achieved with 30 vol.% SiC/CF hybrid fillers, which is about nine times higher than that of native epoxy resin of 0.202 W (m.K)−1.

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“…During the last few decades, lots of thermal conductivity composites have been prepared by the use of suitable fillers such as aluminum [2], BN [3], silicon carbide [4] and graphite [5]. In this study, aluminum nitride(AlN) was chosen as ceramic filler due to its high thermal conductivity, high strength, reliable electric insulation, low dielectric constant and low cost.…”

Section: Introductionmentioning

confidence: 99%

Thermal Conductivity Polypropylene/Aluminium Nitride Composites

Chen

2011

AMR

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The polypropylene/aluminum nitride (PP/AlN) thermal conductivity composites were prepared by compression moulding method. Results revealed that the thermal conductivity of the composites were increased with the increasing AlN, and the thermal conductivity of composites was 1.84W/mk filled with 50vol% modified AlN. Both the tensile and impact strength of the composites increased firstly, but decreased with excessive addition of AlN. For given AlN loading, the surface modification of AlN exhibited a positive effect on the thermal conductivity. Meantime, the grafting of PP could increase the thermal conductivity of the composites compared with pure PP. And the addition of AlN did not change the crystal form of PP, but decrease the crystallinity of the composites.

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Studies on Preparation and Property Researches of EP/SiC Thermal Conductivity Composites

Cited by 12 publications

References 14 publications

Thermal, Mechanical and Electrical Properties of Linear Low-Density Polyethylene Composites Filled with Different Dimensional SiC Particles

Thermal, Mechanical and Electrical Properties of Linear Low-Density Polyethylene Composites Filled with Different Dimensional SiC Particles

Enhanced thermal and electrical properties of epoxy/carbon fiber–silicon carbide composites

Thermal Conductivity Polypropylene/Aluminium Nitride Composites

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