Studies on the effect of processing parameters on electroless coating of copper on boron carbide particles

Abstract

Boron carbide a hard refractory semiconductor ceramic material due to its unique structural properties and high neutron cross section finds application as structural materials and neutron shielding material. Its applicability is reduced due to low sinterbility and dispersiblity which can be overcome by copper coating. The effect of Electroless coating parameters on the surface deposits is characterised. The studies revealed that uniform and smooth coating was observed for pH11 at bath temperature of 348K. The prolonged suspension of B 4 C particles on the reaction bath has little effect on coating but it inturns reduces the adhesion of coating on activated particles.

Studies on electroless nickel boride coating on boron carbide particles

“…Electroless Ni-B alloy coating was carried out on alkali surface treated boron carbide particles of 20 mm average particle size and BET surface area of 1?0304¡ 0?0081 m 2 g 21 supplied by Boron carbide India Ltd. 14 The surface pretreated particles were sensitised using 100 mL Sn(II) solutions (0?0221M SnCl 2 .2H 2 O, 0?306M HCl) and activated subsequently using 100 mL Pd(II) solutions (0?0468 mM PdCl 2 , 0?306M HCl) under sonication for 30 min to ensure effective and smooth adhesion over the particle surface. Activated particles were thoroughly washed using distilled water and 1 g of particles was introduced into 100 mL of electroless Ni-B metallisation solution containing 0?1254M Ni salt (metallic source), 0?0205M Na 2 EDTA (complexing agent), 0?2627 mM thiourea (stabiliser) and 2?222 mM lactic acid under constant magnetic agitation.…”

Formation of Electroless Ni-B Coating on Boron Carbide Particles for Composite Processing

“…Boron carbide particles with average particle size of 20µm synthesised through carbothermal reduction was used in the present study. Surface treatment with sodium hydroxide under optimised condition was carried out based on previous studies [12][13]. The surface cleaned particles were sensitized with Sn +2 ions followed by activation with Pd +2 to enhance the bondability between ceramic phases and metallic ions from the autocatalytic reduction bath.…”

Electroless deposition (ED) of copper coating on micron-sized SiC particles

“…The ED technique has been shown to controllably provide coatings of homogenous thickness on complex shaped components. [9][10][11][12][13][14][15][16][17][18][19] Beygi et al reported the formation of Cu coated alumina particles using an electroless method. 9 They investigated the effects of bath temperature, pH value, stirring speed, plating time, pouring rate, bath chemical condition, ceramic concentration, pre-treatment process, and ceramic particle size on the coating efficiency.…”