Studies on UV‐stable silicone–epoxy resins

Huang, Wei; Zhang, Ying; Yu, Yunzhao; Yuan, Youxue

doi:10.1002/app.26188

Cited by 63 publications

(42 citation statements)

References 59 publications

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“…Phosphor settling can occur any time after the preparaion of phosphor paste by the mixing inorganic phosphor powder in the silicone resin due to the density difference. Two important stages are the dispensing of phosphor paste and the curing of the paste after the dispensing process; studies on these processes were reported by Sommer et al 11 and Luo et al respectively. We focused on the settling of phosphor in the dispensing stage by examining the rheological and settling properties of the phosphor pastes.…”

Section: Rheological Properties Of Phosphor Pastesmentioning

confidence: 98%

Effect of Nano-Silica Filler on the Uniform Packaging of White Light Emitting Diodes

Hyeon¹,

Kim²,

Park³

2013

j. nanosci. nanotech.

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The packaging process of white light-emitting diodes (WLEDs) take a relatively long time, even when utilizing an automated dispensing system. Therefore the silicone-based packaging formulation and control of rheology during the packaging of LEDs are very important. The effect of phosphor settling during the curing state of LED packaging has been reported. In this work we studied the effect of phosphor paste on the dispensing stage of the WLEDs packaging process utilizing nanosilica particles as viscosity modifiers. With nano-silica in the silicone resin the sedimentation of YAG phosphor particles were effectively blocked and a uniform distribution of YAG phosphor in the cured silicon resin could be achieved. We also examined the incorporation of red quantum dots (QDs) to improve the color rendering index of the WLEDs with the aid of nano-silica as a rheological additive. The application of nano-silica in the layer-by-layer type encapsulation of red QDs was found to be effective in WLEDs packaging, which improved the color rendering index with warm white emission.

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Section: Rheological Properties Of Phosphor Pastesmentioning

confidence: 98%

Effect of Nano-Silica Filler on the Uniform Packaging of White Light Emitting Diodes

Hyeon¹,

Kim²,

Park³

2013

j. nanosci. nanotech.

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“…[11] Cationic polymerization of epoxy resin and polysilsesquioxanes using [Al(acac) 3 ] as a catalyst for reaction between silanol groups and epoxide groups was reported by S. Zheng et al. [12] The benefits of cationic polymerization are the high reactivity and no need to add hardeners at the extremely low content of catalyst.…”

Section: Introductionmentioning

confidence: 97%

Preparation and properties of epoxy resin/silicone hybrids for electronic applications

Lee

Song

Lee

et al. 2009

2009 11th Electronics Packaging Technology Conference

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Epoxy resin/silicone hybrids were synthesized through the cationic polymerization of a cycloaliphatic epoxy resin and a hydroxy-terminated poly(dimethyl siloxane) (PDMS) in different molar ratios. Molar ratios of the epoxy resin and silicone for the hybrids were 1/1, 1/0.75, 1/0.5, 1/0.25. 3-Glycidoxypropyl-trimethoxysilane (GPTMS) was also added to the epoxy resin/silicone mixtures to improve the transparency by the reaction between GPTMS and the resin mixtures. The hybrids of epoxy resin/silicone became transparent with increasing the content of PDMS. The addition of GPTMS resulted in the large increase of transparency of the hybrids even at lower concentration of PDMS. Some opaque hybrid samples showed two glass transition temperatures in the thermograms obtained with differential scanning calorimetery (DSC). In case of the hybrids containing GPTMS, nanoparticles of silica were observed in transmission electron microscopy (TEM) images even though they appeared highly transparent after cure.

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“…Extensive investigations have been conducted to increase the aging resistance of epoxy resins: * Address correspondence to: Wei Huang, Institute of Chemistry, Chinese Academy of Sciences, Beijing 100190, P. R. China.Tel: +86 10 62558109; Fax: +86 10 62558109. E-mail: huangwei@ iccas.ac.cn hydrogenated DGEBA epoxy resins were used instead of DGEBA due to the poor resistance of aromatic rings against UV light (3,4); adamantane-based epoxy resins were investigated for the reason of high heat resistance of adamantane ring (5); siloxane composition was introduced into the epoxy resins because of the high stability of Si-O bonds against thermal and UV light (6)(7)(8)(9). Besides, various thermal and UV stabilizers were added into the epoxy resins to improve the aging resistance (4,10).…”

Section: Introductionmentioning

confidence: 99%

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

Yang

Zhao

Zhang

et al. 2011

Journal of Macromolecular Science, Part A

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Two novel silphenylene-containing cycloaliphatic epoxy resins, 1,4-di [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (DEDSB) and 1,3,5-tri [2-(3, 4-epoxycyclohexylethyl) dimethylsilyl] benzene (TEDSB) were synthesized through in situ Grignard reaction and hydrosilylation, and characterized by FT-IR and 1 H-NMR. They were colorless transparent viscous liquids. Methyhexahydrophthalic anhydride (MeHHPA) was used to cure the epoxy resins to give glassy solids with high optical clarity. Differential scanning calorimetry (DSC) results indicated that DEDSB and TEDSB showed similar curing reactivity. The cured TEDSB had a higher glass transition temperature, a higher storage modulus and a lower coefficient of linear thermal expansion than the cured DEDSB due to a higher crosslink density. The cured silphenylene-containing epoxy resins exhibited a much higher resistance to discoloration under UV irradiation than the commonly used epoxy resins diglycidyl ether of bisphenol-A (DGEBA). XPS analysis revealed that they were much less susceptible to photo-oxidation than DGEBA.

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Studies on UV‐stable silicone–epoxy resins

Cited by 63 publications

References 59 publications

Effect of Nano-Silica Filler on the Uniform Packaging of White Light Emitting Diodes

Effect of Nano-Silica Filler on the Uniform Packaging of White Light Emitting Diodes

Preparation and properties of epoxy resin/silicone hybrids for electronic applications

Synthesis and Properties of Silphenylene-containing Epoxy Resins with High UV-stability

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